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The upgrade to the High Luminosity Large Hadron Collider will pose unprecedented challenges to the tracking systems of all experiments. Recent advancement of active pixel detectors designed in CMOS processes provide attractive alternatives…

Instrumentation and Detectors · Physics 2017-09-13 T. Bisanz , J. Große-Knetter , A. Quadt , J. Rieger , J. Weingarten

CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a…

The ATLAS Planar Pixel Sensor R&D Project is a collaboration of 17 institutes and more than 80 scientists. Their goal is to explore the operation of planar pixel sensors for the tracker upgrade at the High Luminosity-Large Hadron Collider…

Instrumentation and Detectors · Physics 2015-06-05 Christian Gallrapp

The Inner Tracking System (ITS) of the ALICE experiment at CERN will undergo an upgrade during the LHC long shutdown 3, in which the three innermost tracking layers will be replaced. This upgrade, named the Inner Tracking System 3 (ITS3),…

Instrumentation and Detectors · Physics 2023-12-14 M. Buckland

The Advanced X-ray Imaging Satellite (AXIS) is a NASA probe class mission concept designed to deliver arcsecond resolution with an effective area ten times that of Chandra (at launch). The AXIS focal plane features an MIT Lincoln Laboratory…

Deep sub micron HV-CMOS processes offer the opportunity for sensors built by industry standard techniques while being HV tolerant, making them good candidates for drift-based, fast collecting, thus radiation-hard pixel detectors. For the…

Instrumentation and Detectors · Physics 2016-09-21 Branislav Ristic

This paper presents experimental and simulation data to characterize the Ring Oscillators (RO) produced in 65-nm CMOS technology for the next promising generation of readout chips for the pixel detector in the Inner Tracker (ITk) at the…

Instrumentation and Detectors · Physics 2026-01-22 Yahya Khwaira , Abdenour Lounis , Maurice Cohen-Solal , Mohsine Menouni , Pierre Barrillon , Denis Fougeron

In view of the high luminosity phase of the LHC (HL-LHC) to start operation around 2026, a major upgrade of the tracker system for the ATLAS experiment is in preparation. The expected neutron equivalent fluence of up to 2.4 * 1e16 1 MeV…

Instrumentation and Detectors · Physics 2018-02-14 Julien-Christopher Beyer , Alessandro La Rosa , Anna Macchiolo , Natascha Savic , Reem Taibah

An upgrade of the ATLAS experiment for the High Luminosity phase of LHC is planned for 2024 and foresees the replacement of the present Inner Detector (ID) with a new Inner Tracker (ITk) completely made of silicon devices. Depleted active…

The Skipper-in-CMOS image sensor integrates the non-destructive readout capability of Skipper Charge Coupled Devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode in a CMOS imaging process, while taking advantage of…

Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel…

The M\"ONCH hybrid pixel detector, with a 25 \textmu m pixel pitch and fast charge-integrating readout, has demonstrated subpixel resolution capabilities for X-ray imaging and deep learning-based electron localization in electron…

For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation…

Instrumentation and Detectors · Physics 2008-11-26 Fabian Huegging

In the construction of High-Luminosity Large Hadron Collider (HL-LHC) and Future Circular Collider (FCC) experiments, 3D pixel sensors have become indispensable components due to their superior radiation hardness, fast response, and low…

Instrumentation and Detectors · Physics 2025-10-14 Huimin Ji , Zhihua Li , Wenzheng Cheng , Zheng Li , Kai Huang , Jing Wen , Song Liu , Manwen Liu , Jun Luo

The physics aims at the proposed future CLIC high-energy linear $e^+ e^-$ collider pose challenging demands on the performance of the detector system. In particular the vertex and tracking detectors have to combine precision measurements…

Instrumentation and Detectors · Physics 2019-09-04 Mathieu Benoit

We have been developing the X-ray silicon-on-insulator (SOI) pixel sensor called XRPIX for future astrophysical satellites. XRPIX is a monolithic active pixel sensor consisting of a high-resistivity Si sensor, thin SiO$_2$ insulator, and…

Instrumentation and Methods for Astrophysics · Physics 2020-01-29 K. Hagino , K. Negishi , K. Oono , K. Yarita , T. Kohmura , T. G. Tsuru , T. Tanaka , S. Harada , K. Kayama , H. Matsumura , K. Mori , A. Takeda , Y. Nishioka , M. Yukumoto , K. Fukuda , T. Hida , Y. Arai , I. Kurachi , S. Kishimoto

We report the demonstration of a low-power pixelated readout system designed for three-dimensional ionization charge detection and digital readout of liquid argon time projection chambers (LArTPCs). Unambiguous 3D charge readout was…

Instrumentation and Detectors · Physics 2018-10-12 D. A. Dwyer , M. Garcia-Sciveres , D. Gnani , C. Grace , S. Kohn , M. Kramer , A. Krieger , C. J. Lin , K. B. Luk , P. Madigan , C. Marshall , H. Steiner , T. Stezelberger

Hybrid silicon pixel detectors are currently used in the innermost tracking system of the Compact Muon Solenoid (CMS) experiment. Radiation tolerance up to fluences expected for a few years of running of the Large Hadron Collider (LHC) has…

Instrumentation and Detectors · Physics 2011-10-07 Gemma Tinti

In order to meet the requirements of the High Luminosity LHC (HL-LHC), it will be necessary to replace the current tracker of the ATLAS experiment. Therefore, a new all-silicon tracking detector is being developed, the so-called Inner…

A new generation of Monolithic Active Pixel Sensors (MAPS), produced in a 65 nm CMOS imaging process, promises higher densities of on-chip circuits and, for a given pixel size, more sophisticated in-pixel logic compared to larger feature…

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