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The implementation of the 2nd generation high-Tc superconductors in power applications, such as electrical transformers, motors and generators requires superconducting wires that are superior to copper Litz wires at cryogenic temperatures…
Chemical segregation and structural transitions at interfaces are important nanoscale phenomena, making them natural targets for atomistic modeling, yet interatomic potentials must be fit to secondary physical properties. To isolate the…
In this review article we consider the crack growth resistance ofmicrometer and submicrometer sized samples from the fracture mechanics point of view. Standard fracture mechanics test procedures were developed for macroscale samples, and…
Thanks to their unique properties single-layer 2-D materials appear as excellent candidates to extend Moore's scaling law beyond the currently manufactured silicon FinFETs. However, the known 2-D semiconducting components, essentially…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
Light-weight alloys are essential pillars of transportation technologies. They also play a crucial role to achieve a more green and cost-effective aerospace technologies. Magnesium-lithium-aluminum (Mg-Li-Al) alloys are auspicious…
Materials in which electrons occupy interstitial sites as anions are called electrides and exhibit unusual dimensionality-dependent electronic behavior. These properties make electrides attractive for catalysis, transparent conductors, and…
Crystal structures are indispensable across various domains, from batteries to solar cells, and extensive research has been dedicated to predicting their properties based on their atomic configurations. However, prevailing Crystal Structure…
Recent trends of ab initio studies and progress in methodologies for electronic structure calculations of strongly correlated electron systems are discussed. The interest for developing efficient methods is motivated by recent discoveries…
There are increasing number of works addressing the design challenges of fast, scalable solutions for the growing number of new type of applications. Recently, many of the solutions aimed at improving processing element capabilities to…
Altermagnetism has recently drawn considerable attention in three- and twodimensional materials. Here, we extend this concept to quasi-one-dimensional (Q1D) monolayers assembled from single-atomic magnetic chains. Through systematically…
One of the major industrial challenges is to profit from some fascinating physical features present at the nanoscale. The production of dissipationless nanoswitches (or nanocontacts) is one of such attractive applications. Nevertheless, the…
As silicon transistors scale toward future technology nodes, three-dimensional architectures -- including gate-all-around (GAA) nanoribbon and complementary field-effect transistors (CFETs) -- require channel widths in the tens of…
The advantages introduced by carbon fiber reinforced polymer (CFRP) composites has made them an appropriate choice in many applications and an ideal replacement for conventional materials. The benefits using CFRP composites are due to their…
Atomically thin metallenes are a new family of materials representing the ultimate limit of a thin free-electron gas for novel applications. Although metallene research has gained traction, limited attention has been paid to the properties…
With the evolution of heterogeneous computing system, such as network-on-chip, high-performance distributed computing, accelerator-rich architectures and cluster computing, high-speed, energy-efficient and low-latency interfaces among…
Topological quantum materials hold great promise for future technological applications. Their unique electronic properties, such as protected surface states and exotic quasiparticles, offer opportunities for designing novel electronic…
Modern machine learning (ML) applications are becoming increasingly complex and monolithic (single chip) accelerator architectures cannot keep up with their energy efficiency and throughput demands. Even though modern digital electronic…
The transistors used to construct Integrated Circuits (ICs) continue to shrink. While this shrinkage improves performance and density, it also reduces trust: the price to build leading-edge fabrication facilities has skyrocketed, forcing…
The search for new hard materials is often challenging from both theoretical and experimental points of view. Furthermore, using materials for biomedical applications calls for alloys with high biocompatibility which are even more sparse.…