English

Radio Frequency Modulated Signaling Interconnect for Memory-to-Processor and Processor-to-Processor Interfaces: An Overview

Emerging Technologies 2017-01-03 v2

Abstract

With the evolution of heterogeneous computing system, such as network-on-chip, high-performance distributed computing, accelerator-rich architectures and cluster computing, high-speed, energy-efficient and low-latency interfaces among memory-to-processor and processor-to-processor become the key technology to enable those technologies. Simultaneously, the scaling of CMOS makes the switching speed of the transistor up to sub-THz. Radio-frequency or even millimeter-wave modulated signaling interconnect has unique features in ultra-low power operation, dynamic allocation of bandwidth and low latency, compared with convention baseband signaling interconnect. In this work, we overview the different generations of radio-frequency interconnect (RF-I) technology, compare them with conventional baseband signaling interconnect technologies. The limitations and potentials are also discussed in the end.

Keywords

Cite

@article{arxiv.1612.06522,
  title  = {Radio Frequency Modulated Signaling Interconnect for Memory-to-Processor and Processor-to-Processor Interfaces: An Overview},
  author = {Jason Y. Du},
  journal= {arXiv preprint arXiv:1612.06522},
  year   = {2017}
}

Comments

5 pages, 10 figures, conference

R2 v1 2026-06-22T17:29:07.590Z