Related papers: TDRAM: Tag-enhanced DRAM for Efficient Caching
This paper investigates bandwidth-efficient DRAM caching for hybrid DRAM + 3D-XPoint memories. 3D-XPoint is becoming a viable alternative to DRAM as it enables high-capacity and non-volatile main memory systems; however, 3D-XPoint has 4-8x…
We propose overcoming the memory capacity limitation of GPUs with high-capacity Storage-Class Memory (SCM) and DRAM cache. By significantly increasing the memory capacity with SCM, the GPU can capture a larger fraction of the memory…
In modern systems, DRAM-based main memory is significantly slower than the processor. Consequently, processors spend a long time waiting to access data from main memory, making the long main memory access latency one of the most critical…
Over the past two decades, the storage capacity and access bandwidth of main memory have improved tremendously, by 128x and 20x, respectively. These improvements are mainly due to the continuous technology scaling of DRAM (dynamic…
Die-stacked DRAM is a promising solution for satisfying the ever-increasing memory bandwidth requirements of multi-core processors. Manufacturing technology has enabled stacking several gigabytes of DRAM modules on the active die, thereby…
This paper summarizes the idea of Tiered-Latency DRAM (TL-DRAM), which was published in HPCA 2013, and examines the work's significance and future potential. The capacity and cost-per-bit of DRAM have historically scaled to satisfy the…
DRAM-based memory is a critical factor that creates a bottleneck on the system performance since the processor speed largely outperforms the DRAM latency. In this thesis, we develop a low-cost mechanism, called ChargeCache, which enables…
In recommendation systems, practitioners observed that increase in the number of embedding tables and their sizes often leads to significant improvement in model performances. Given this and the business importance of these models to major…
This paper summarizes the idea of Tiered-Latency DRAM, which was published in HPCA 2013. The key goal of TL-DRAM is to provide low DRAM latency at low cost, a critical problem in modern memory systems. To this end, TL-DRAM introduces…
Putting the DRAM on the same package with a processor enables several times higher memory bandwidth than conventional off-package DRAM. Yet, the latency of in-package DRAM is not appreciably lower than that of off-package DRAM. A promising…
This paper investigates hardware-based memory compression designs to increase the memory bandwidth. When lines are compressible, the hardware can store multiple lines in a single memory location, and retrieve all these lines in a single…
Ternary content addressable memory (TCAM) has been a critical component in caches, routers, etc., in which density, speed, power efficiency, and reliability are the major design targets. There have been the conventional low-write-power but…
Caching is crucial for enabling high-throughput networks for data intensive applications. Traditional caching technology relies on DRAM, as it can transfer data at a high rate. However, DRAM capacity is subject to contention by most system…
Hybrid main memory systems combine both performance and capacity advantages from heterogeneous memory technologies. With larger capacities, higher associativities, and finer granularities, hybrid memory systems currently exhibit significant…
DRAM Main memory is a performance bottleneck for many applications due to the high access latency. In-DRAM caches work to mitigate this latency by augmenting regular-latency DRAM with small-but-fast regions of DRAM that serve as a cache for…
Retrieval-Augmented Generation (RAG) enhances large language models (LLMs) by integrating external knowledge retrieval but faces challenges on edge devices due to high storage, energy, and latency demands. Computing-in-Memory (CIM) offers a…
Dynamic Random Access Memory (DRAM) is the de-facto choice for main memory devices due to its cost-effectiveness. It offers a larger capacity and higher bandwidth compared to SRAM but is slower than the latter. With each passing generation,…
In this paper, we propose a 'full-stack' solution to designing high capacity and low latency on-chip cache hierarchies by starting at the circuit level of the hardware design stack. First, we propose a novel Gain Cell (GC) design using…
3D die-stacked DRAM has emerged as a key technology for delivering high bandwidth and high density for applications such as high-performance computing, graphics, and machine learning. However, different applications place diverse and…
Many convolutional neural network (CNN) accelerators face performance- and energy-efficiency challenges which are crucial for embedded implementations, due to high DRAM access latency and energy. Recently, some DRAM architectures have been…