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In this paper the methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation will be introduced. With the proposed…
Superconducting circuits are a promising platform for implementing fault-tolerant quantum computers, quantum limited amplifiers, ultra-low power superconducting electronics, and sensors with ultimate sensitivity. Typically, circuit…
A powerful and flexible method of 3D nano-printing, based on focusing charged aerosol, has been developed. The self-consistent electric field configuration, created with a holey floating mask and used as the scaffold for printing…
A comprehensive evaluation of the effect and limitations of variable current density and electrolyte composition on layer porosity and microstructure changes of porous silicon (pSi) multilayer stacks is reported. Following these results,…
Today, continued miniaturization in electronic integrated circuits (ICs) appears to have reached its fundamental limit. At the same time, energy consumption due by communication becomes the dominant limitation in high performance electronic…
Reverse engineering can be used to derive a 3D model of an existing physical part when such a model is not readily available. For parts that will be fabricated with subtractive and formative manufacturing processes, existing reverse…
Soft electronics have recently gathered considerable interest thanks to their bio-mechanical compatibility. An important feature of such deformable conductors is their electrical response to strain. While development of stretchable…
This paper presents a preliminary study exploring the feasibility of designing batteryless electronic shelf labels (ESLs) powered by radio frequency wireless power transfer using commercial off-the-shelf components. The proposed ESL design…
This paper presents a generalized construction of RS-SPC product codes. A low-complexity joint-decoding scheme is proposed for these codes, in which a BP-based iterative decoding is performed based on the binary expansion of the whole…
Developable surfaces are commonly observed in various applications such as architecture, product design, manufacturing, mechanical materials, and data physicalization as well as in the development of tangible interaction and deformable…
Designing 3D objects from scratch is difficult, especially when the user intent is fuzzy without a clear target form. In the spirit of modeling-by-example, we facilitate design by providing reference and inspiration from existing model…
The traditional SerDes link simulation process begins with the extraction of printed circuit board (PCB) physical stripline and via models, followed by channel modeling and link simulation. We invert this simulation flow by first creating…
Recent work has demonstrated that the interior material layout of a 3D model can be designed to make a fabricated replica satisfy application-specific demands on its physical properties such as resistance to external loads. A widely used…
There is a strong interest to attach nanoparticles non-covalently to one-dimensional systems like boron nitride nanotubes to form composites. The combination of those materials might be used for catalysis, in solar cells, or for water…
The rapid rise of artificial intelligence, and in-memory computing has reinvigorated research on scalable, energy-efficient, and reconfigurable photonic hardware. Non-volatile phase-change materials (PCMs) are attractive, as they offer…
Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed elements allow for efficient coupling of light to etched facets of nanophotonic…
Deploying fibrous membranes for passive daytime radiative cooling (PDRC) on large and irregular surfaces is highly desirable but remains challenging, owing to the slow deposition rates and the need for electrically conductive substrates in…
This work introduces a novel technique for fabricating functional robots using 3D printers. Simultaneously depositing photopolymers and a non-curing liquid allows complex, pre-filled fluidic channels to be fabricated. This new printing…
In a CMOS image sensor pixel, fast and complete charge transfer from pinned photodiode (PPD) is desired and necessary in some applications. In special cases such as time-of-flight imaging or large pinned photodiodes, the PPD potential well…
In recent years, the energy consumption of computing systems has increased and a large fraction of this energy is consumed in main memory. Towards this, researchers have proposed use of non-volatile memory, such as phase change memory…