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Vertebrate animals benefit from a combination of rigidity for structural support and softness for adaptation. Similarly, integrating rigidity and softness can enhance the versatility of soft robotics. However, the challenges associated with…
The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable…
Solid-state nanopores, nm-sized holes in thin, freestanding membranes, are powerful single-molecule sensors capable of interrogating a wide range of target analytes, from small molecules to large polymers. Interestingly, due to their high…
In most macro-scale robotics systems , propulsion and controls are enabled through a physical tether or complex on-board electronics and batteries. A tether simplifies the design process but limits the range of motion of the robot, while…
Triangular cross-section color center photonics in silicon carbide is a leading candidate for scalable implementation of quantum hardware. Within this geometry, we model low-loss beam splitters for applications in key quantum optical…
Electron spins in semiconductor devices are highly promising building blocks for quantum processors (QPs). Commercial semiconductor foundries can create QPs using the same processes employed for conventional chips, once the QP design is…
Adaptable, reconfigurable and programmable are key functionalities for the next generation of silicon-based photonic processors, neural and quantum networks. Phase change technology offers proven non-volatile electronic programmability,…
The emerging new paradigm of technologies, the internet of things, entails a process of device miniaturization to combine several functional components, such as sensors, actuators, and powering elements, in a single individual on-chip…
A direct electronics printing technique through atomized spraying for patterning room temperature liquid metal droplets on desired substrate surfaces is proposed and experimentally demonstrated for the first time. This method has…
Optimizing high-performance power electronic equipment, such as power converters, requires multiscale simulations that incorporate the physics of power semiconductor devices and the dynamics of other circuit components, especially in…
We present an analytical scheme for the design of realistic metagratings for wide-angle engineered reflection. These recently proposed planar structures can reflect an incident plane wave into a prescribed (generally non-specular) angle…
Three-dimensional device integration facilitates the construction of superconducting quantum information processors with more than several tens of qubits by distributing elements such as control wires, qubits, and resonators between…
Automated detection of defects in Printed Circuit Board (PCB) manufacturing using Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) machines can help improve operational efficiency and significantly reduce the need for…
Use of 2G HTS coated conductors in several power applications has become popular in recent years. Their large current density under high magnetic fields makes them suitable candidates for high power capacity applications such as stacks,…
4H-silicon carbide is a promising platform for solid-state quantum technology due to its commercial availability as a wide bandgap semiconductor and ability to host numerous spin-active color centers. Integrating color centers into…
Polycube segmentations for 3D models effectively support a wide variety of applications such as seamless texture mapping, spline fitting, structured multi-block grid generation, and hexahedral mesh construction. However, the automated…
A method for designing transformation electromagnetics devices using tensor impedance surfaces (TISs) is presented. The method is first applied to idealized tensor impedance boundary conditions (TIBCs), and later to printed-circuit tensor…
With the upgrade of the RPCs [1]-[2] and the increase of its performances, the study and the optimization of the read-out panel is necessary in order to maintain the signal integrity and to reduce the intrinsic crosstalk. Through…
3D printing has enabled various applications using different forms of materials, such as filaments, sheets, and inks. Typically, during 3D printing, feedstocks are transformed into discrete building blocks and placed or deposited in a…
Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-on-Chip (SoC) architectures. Although Moore's Law has been able to…