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Three-dimensional (3D) photonic integration offers a pathway to overcome the fundamental scaling limitations of planar platforms by enabling enhanced routing flexibility for compact, low-loss, and highly interconnected photonic circuits. In…
Hybrid photonic integration exploits complementary strengths of different material platforms, thereby offering superior performance and design flexibility in comparison to monolithic approaches. This applies in particular to multi-chip…
Today, continued miniaturization in electronic integrated circuits (ICs) appears to have reached its fundamental limit. At the same time, energy consumption due by communication becomes the dominant limitation in high performance electronic…
Photonic integrated circuits are gaining traction in the field of telecommunications and information processing for their low-loss and high-throughput data transmission in comparison to electronic integrated circuits. However, they are…
Femtosecond laser writing in glass was harnessed to fabricate photonic circuits comprised of waveguides, micro-mirrors, and fiber sockets, in an optical interposer chip. The compact design enabled ultra-dense routing of 40 optical channels…
Photonic integrated circuits (PICs) play a crucial role in almost every aspect of modern life, such as data storage, telecommunications, medical diagnostics, green energy, autonomous driving, agriculture, and high-performance computing. To…
We present a photonic coupler that exhibits effectively wavelength-agnostic performance for ultra-broadband optical interfacing. By incorporating a dual-ellipsoidal geometry, the design facilitates quasi-free-space optical propagation. We…
Photonic waveguides are prime candidates for integrated and parallel photonic interconnects. Such interconnects correspond to large-scale vector matrix products, which are at the heart of neural network computation. However, parallel…
Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…
Photonic integration has witnessed tremendous progress over the last years, and chip-scale transceiver systems with Terabit/s data rates have come into reach. However, as on-chip integration density increases, efficient off-chip interfaces…
Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed elements allow for efficient coupling of light to etched facets of nanophotonic…
Dense and efficient circuits with component sizes approaching the physical limit is the hallmark of high performance integration. However, current fabrication technology is mostly constraint to 2D lithography, and thermal energy dissipation…
Integrated nonlinear photonic circuits received rapid development in recent years, providing all-optical functionalities enabled by cavity-enhanced photon-photon interaction for classical and quantum applications. A high-efficiency…
Quantum information processing holds great promise for communicating and computing data efficiently. However, scaling current photonic implementation approaches to larger system size remains an outstanding challenge for realizing disruptive…
2.5D chiplet systems have been proposed to improve the low manufacturing yield of large-scale chips. However, connecting the chiplets through an electronic interposer imposes a high traffic load on the interposer network. Silicon photonics…
Fibre optic technology connects the world through the Internet, enables remote sensing, and connects disparate functional optical devices. Highly confined silicon photonics promises extreme scale and functional integration. However, the…
Integrated photonics has profoundly impacted a wide range of technologies underpinning modern society. The ability to fabricate a complete optical system on a chip offers unrivalled scalability, weight, cost and power efficiency. Over the…
We demonstrate comprehensive numerical studies on a hybrid III-V/Si-based waveguide system, serving as a platform for efficient light coupling between an integrated III-V quantum dot emitter to an on-chip quantum photonic integrated circuit…
We propose a practical and efficient solution for the coupling of light from integrated single-mode waveguides to supercollimating planar photonic crystals on conventional silicon-on-insulator platforms. The device consists of a rib…
We propose and experimentally demonstrate a photonic routing architecture that can efficiently utilize the space of multi-plane (3D) photonic integration. A wafer with three planes of amorphous silicon waveguides was fabricated and…