Related papers: RapidChiplet: A Toolchain for Rapid Design Space E…
This paper focuses on the simulation of multi-die System-on-Chip (SoC) architectures using VisualSim, emphasizing chiplet-based system modeling and performance analysis. Chiplet technology presents a promising alternative to traditional…
Achieving high performance, energy efficiency, and cost-effectiveness while maintaining architectural flexibility is a critical challenge in the development and deployment of edge AI devices. Monolithic SoC designs struggle with this…
Due to reduced manufacturing yields, traditional monolithic chips cannot keep up with the compute, memory, and communication demands of data-intensive applications, such as rapidly growing deep neural network (DNN) models. Chiplet-based…
Transformers have revolutionized deep learning and generative modeling, enabling advancements in natural language processing tasks. However, the size of transformer models is increasing continuously, driven by enhanced capabilities across…
In-memory computing (IMC) on a monolithic chip for deep learning faces dramatic challenges on area, yield, and on-chip interconnection cost due to the ever-increasing model sizes. 2.5D integration or chiplet-based architectures interconnect…
Advanced 2.5D Systems-in-Package (SiPs) compose a growing portion of high-performance systems. While the packaging and interconnect choices play a large role in the overall system design, system architects still lack a suitable framework…
A chiplet is an integrated circuit that encompasses a well-defined subset of an overall system's functionality. In contrast to traditional monolithic system-on-chips (SoCs), chiplet-based architecture can reduce costs and increase…
Vision Transformers (ViTs) have established new performance benchmarks in vision tasks such as image recognition and object detection. However, these advancements come with significant demands for memory and computational resources,…
2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects (ICIs). As the number of chiplets…
With the increasing prevalence of chiplet systems in high-performance computing applications, the number of design options has increased dramatically. Instead of chips defaulting to a single die design, now there are options for 2.5D and 3D…
Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…
Modern Artificial Intelligence (AI) workloads demand computing systems with large silicon area to sustain throughput and competitive performance. However, prohibitive manufacturing costs and yield limitations at advanced tech nodes and…
This paper presents our approach to accelerate computer architecture simulation by leveraging machine learning techniques. Traditional computer architecture simulations are time-consuming, making it challenging to explore different design…
Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today's data centers. Heterogeneous computing with domain-specific architectures (DSAs) brings…
To address increasing compute demand from recent multi-model workloads with heavy models like large language models, we propose to deploy heterogeneous chiplet-based multi-chip module (MCM)-based accelerators. We develop an advanced…
Scaling up hardware systems has become an important tactic for improving performance as Moore's law fades. Unfortunately, simulations of large hardware systems are often a design bottleneck due to slow throughput and long build times. In…
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-chiplet interconnect…
Design of next generation computer systems should be supported by simulation infrastructure that must achieve a few contradictory goals such as fast execution time, high accuracy, and enough flexibility to allow comparison between large…
Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D design technologies approach their limits. Heterogeneous integration of smaller chiplets…
On the advent of the slow death of Moore's law, the silicon industry is moving towards a new era of chiplets. The automotive industry is experiencing a profound transformation towards software-defined vehicles, fueled by the surging demand…