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3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
Power electronics systems, widely used in various applications such as industrial automation, electric cars, and renewable energy, have the primary function of converting and controlling electrical power to the desired type of load. Despite…
This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient…
We present an approach to construct position-sensitive silicon detectors with an integrated cooling circuit. Tests on samples demonstrate that a very modest liquid flow very effectively cool the devices up to a power dissipation of over…
Achieving efficient three-dimensional feedback cooling of levitated nanoparticles is a key requirement for precision sensing and quantum control in levitated optomechanics. Here we demonstrate three-dimensional optical feedback cooling of a…
Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hot spots requires employing efficient cooling techniques. Using embedded channels, liquid cooling systems can be designed to…
In this work, some of the parameters influencing the cooling capacity of a liquid jet impinging onto Inconel 718 and C45 plates were experimentally investigated. The experiment included a high-speed camera to record the dynamic of the jet…
Efficient thermal management is critical for ensuring the safety, performance, and durability of lithium ion pouch cells (LIPCs), particularly under high power operating conditions where conventional battery thermal management systems…
We present an experimental unit that realizes the ``multi-input, multi-output manifold'' thermal management technology proposed by Lamarre & Raymond (2023). The proposed setup can be used for experiments aimed at controlling spatiotemporal…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
We present a simple layout of a fast cooling system for liquids in sealed containers utilizing the large temperature gradients of cold nitrogen gas. Our system is optimized for about 20 cylindrical containers of 500 cm3 but the setup allows…
Liquid Crystal Elastomers with near-ambient temperature-responsiveness (NAT-LCEs) have been extensively studied for building bio-compatible, low-power consumption devices and robotics. However, conventional manufacturing methods face…
Although 3D IC technology can provide very high integration density, they suffer from having hotspots that may reach thousands of degrees. To manage this heat, it is necessary to study the dynamics of cooling and thermal behavior of the…
We propose a highly feasible technique with no experimental overhead to rapidly cool the in-plane degrees of freedom of large two-dimensional ion crystals in Penning traps. Through simulations, we demonstrate that our approach enables the…
This paper suggests a novel rotor-cooling shaft concept for high-performance electric motors that increases the effectiveness of cooling and is yet simple and cost-effective to manufacture. We investigate the thermal performance of four…
Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enables more opportunities to architect 3DICs with different die…
Micro-channel cooling initially aiming at small-sized high-power integrated circuits is being transferred to the field of high energy physics. Today`s prospects of micro-fabricating silicon opens a door to a more direct cooling of detector…
Microfabricated ion-trap devices offer a promising pathway towards scalable quantum computing. Research efforts have begun to focus on the engineering challenges associated with developing large-scale ion-trap arrays and networks. However,…
Direct ink writing (DIW) using frontal ring-opening metathesis polymerization (FROMP) offers a compelling route to the rapid and energy-efficient fabrication of thermoset and elastomeric polymer architectures, leveraging a self-propagating…
In this work a numerical model for two-dimensional axisymmetric continuous freezing by impingement of processed meat or similar products in food industry moving along a conveyor belt is presented. The model represents a more computationally…