Related papers: Liquid Cooling System for a High Power, Medium Fre…
Liquid jet impingement cooling is an efficient cooling technique where the liquid coolant is directly ejected from nozzles on the chip backside resulting in a high cooling efficiency due to the absence of the TIM and the lateral temperature…
A class of low-power cooling (LPC) codes, to control simultaneously both the peak temperature and the average power consumption of interconnects, was introduced recently. An $(n,t,w)$-LPC code is a coding scheme over $n$ wires that (A)…
The complex time-dependent heat and electromagnetic energy transfer in a new type of cooling system is analyzed. The system consists of a cold body, a Peltier element and an electric circuit containing an inductor with controllable…
The bottleneck in modern thermoelectric power generation and cooling is the low energy conversion efficiency of thermoelectric materials. The detrimental effects of lattice phonons on performance can be mitigated, but achieving a high…
Current vapor-compression technology is based on the gas-liquid transition of hazardous gas. The alternative cooling technology focuses on the solid caloric material. A new liquid barocaloric material, i.e. the liquid crystal, is proved to…
Air cooling is the traditional solution to chill servers in data centers. However, the continuous increase in global data center energy consumption combined with the increase of the racks' power dissipation calls for the use of more…
The room temperature liquid metal is quickly emerging as an important functional material in a variety of areas like chip cooling, 3D printing or printed electronics etc. With diverse capabilities in electrical, thermal and flowing…
This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient…
Solid-state thermoelectric devices are currently used in applications ranging from thermocouple sensors to power generators in satellites, to portable air-conditioners and refrigerators. With the ever-rising demand throughout the world for…
An equation based reduced order model applicable to generalized heat equation and thermal simulations of power electronics systems developed in commercial CFD tools, is presented in this work. The model considers the physics of heat…
Among the auxiliary loads in light-duty vehicles, the air conditioning system is the single largest energy consumer. For electrified vehicles, the impact of heating and cooling loads becomes even more significant, as they compete with the…
The Latent heat storage technology is being used worldwide to bridge the gap between supply and demand of energy. The material store energy during the charging process (melting) and releases energy during the discharging process…
The heart of every switched mode converter consists of several switching semiconductor elements. Due to their non-ideal behaviour there are ON state and switching losses heating up the silicon chip. That heat must effectively be transferred…
Thermoelectric (TE) air cooling is a solid-state technology that has the potential to replace conventional vapor compression-based air conditioning. In this paper, we present a detailed system-level modeling for thermoelectric air…
Data centers handle impressive high figures in terms of energy consumption, and the growing popularity of Cloud applications is intensifying their computational demand. Moreover, the cooling needed to keep the servers within reliable…
The 4th generation of district heating systems face a potential problem where lowered water temperatures lead to higher flow rates, which requires higher hydraulic capacity in terms of pipe and pump sizes. This increases the effect of the…
Virtually all electronic systems try to optimize a fundamental trade-off between higher performance and lower power consumption. The latter becomes critical in mobile computing systems, such as smartphones, which rely on passive cooling.…
The race towards performance increase and computing power has led to chips with heterogeneous and complex designs, integrating an ever-growing number of cores on the same monolithic chip or chiplet silicon die. Higher integration density,…
The first part of this chapter gives an introduction to heat transfer and cooling techniques at low temperature. We review the fundamental laws of heat transfer (conduction, convection and radiation) and give useful data specific to…
Power device reliability is a major concern during operation under extreme environments, as doing so reduces the operational lifetime of any power system or sensing infrastructure. Due to a potential for system failure, devices must be…