Related papers: Automated Semiconductor Defect Inspection in Scann…
In this article, a new scanning electron microscopy (SEM) image composition technique is described, which can significantly reduce drift related image corruptions. Drift-distortion commonly causes blur and distortions in the SEM images.…
Integrated silicon photonic devices, which manipulate light to transmit and process information on a silicon-on-insulator chip, are highly sensitive to structural variations. Minor deviations during nanofabrication-the precise process of…
Defects in crystalline materials control the properties of materials, and their characterization focuses our strategies to optimize performance. Electron microscopy has served as the backbone of our understanding of defect structure and…
Microfluidic devices offer numerous advantages in medical applications, including the capture of single cells in microwell-based platforms for genomic analysis. As the cost of sequencing decreases, the demand for high-throughput single-cell…
Detecting and analyzing various defect types in semiconductor materials is an important prerequisite for understanding the underlying mechanisms as well as tailoring the production processes. Analysis of microscopy images that reveal…
Scanning electron microscopy (SEM), a century-old technique, is today a ubiquitous method of imaging the surface of nanostructures. However, most SEM detectors simply count the number of secondary electrons from a material of interest, and…
Nondestructive evaluation (NDE) techniques are widely used to detect flaws in critical components of systems like aircraft engines, nuclear power plants and oil pipelines in order to prevent catastrophic events. Many modern NDE systems…
This paper tackles two key challenges: detecting small, dense, and overlapping objects (a major hurdle in computer vision) and improving the quality of noisy images, especially those encountered in industrial environments. [1, 2]. Our focus…
Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many…
Scanning transmission electron microscopy (STEM) is now the primary tool for exploring functional materials on the atomic level. Often, features of interest are highly localized in specific regions in the material, such as ferroelectric…
Automatic defect detection for 3D printing processes, which shares many characteristics with change detection problems, is a vital step for quality control of 3D printed products. However, there are some critical challenges in the current…
The scanning electron microscope (SEM) recordings of dynamic nano-electromechanical systems (NEMS) are difficult to analyze due to the noise caused by low frame rate, insufficient resolution and blurriness induced by applied electric…
Integrated circuit manufacturing is highly complex, comprising hundreds of process steps. Defects can arise at any stage, causing yield loss and ultimately degrading product reliability. Supervised methods require extensive human annotation…
In light of globalized hardware supply chains, the assurance of hardware components has gained significant interest, particularly in cryptographic applications and high-stakes scenarios. Identifying metal lines on scanning electron…
The Scanning electron microscope (SEM) and Electron-Dispersive Spectroscope (EDS) are two highly effective instruments in the field of nanoscience and nanotechnology. The quality of these instruments is determined by various factors, with…
Defect engineering has been profoundly employed to confer desirable functionality to materials that pristine lattices inherently lack. Although single atomic-resolution scanning transmission electron microscopy (STEM) images are widely…
Scanning electron microscopy (SEM) is a versatile technique used to image samples at the nanoscale. Conventional imaging by this technique relies on finding the average intensity of the signal generated on a detector by secondary electrons…
To coupe with the difficulties in the process of inspection and classification of defects in Printed Circuit Board (PCB), other researchers have proposed many methods. However, few of them published their dataset before, which hindered the…
In electronics manufacturing, solder joint defects are a common problem affecting a variety of printed circuit board components. To identify and correct solder joint defects, the solder joints on a circuit board are typically inspected…
In semiconductor manufacturing, wafer defect maps (WDMs) play a crucial role in diagnosing issues and enhancing process yields by revealing critical defect patterns. However, accurately categorizing WDM defects presents significant…