Related papers: Component-wise Power Estimation of Electrical Devi…
In this paper, we develop a procedure for the detection of the contours of thermal bridges from thermographic images, in order to study the energetic performance of buildings. Two main steps of the above method are: the enhancement of the…
Data centers are high power consumers and the energy consumption of data centers keeps on rising in spite of all the efforts for increasing the energy efficiency. The need for energy-awareness in data centers makes the use of power modeling…
We present a new method for multi-component power spectra estimation in multi-frequency observations of the CMB. Our method is based on matching a model to the cross and auto power spectra of observed maps. All the component power spectra…
The thermal sensitive electrical parameter (TSEP) method is crucial for enhancing the reliability of power devices through junction temperature monitoring. The TSEP method comprises three key processes: calibration, regression, and…
In this article we propose and numerically implement a mathematical model for the simulation of three-dimensional semiconductor devices characterized by an heterogeneous material structure. The model consists of a system of nonlinearly…
Accurate modeling of charge transport and both thermal and luminescent radiation is crucial to the understanding and design of radiative thermal energy converters. Charge carrier dynamics in semiconductors are well-described by the…
Thermal qualification of the die attach of semiconductor devices is a very important element in the device characterization as the temperature of the chip is strongly affected by the quality of the die attach. Voids or delaminations in this…
While it is known that the amplification of the superconducting critical temperature Tc is possible in a system of multiple electronic components in comparison with a single component system, many different road maps for room temperature…
Despite being regarded as a well-established field, temperature measurement continues to pose significant challenges for many professionals in the metrology industry. Thermal imagers enable fast, non-contact and a full field measurement,…
Resistive RAM (RRAM) devices are candidates for neuromorphic computing devices in which the functionality lies in the formation and reversible rupture and gap-closing of conducting filaments in insulating layers. To explore the thermal…
For several configurations of charges in the presence of conductors, the method of images permits us to obtain some observables associated with such a configuration by replacing the conductors with some image charges. However, simple…
The material eroded from the surface of plasma facing components is redeposited partly close to high heat flux areas. At these locations, the deposit is heated by the plasma and the deposition pattern evolves depending on the operation…
This paper analyzes a transient method for the characterization of low-resistance thermal interfaces of microelectronic packages. The transient method can yield additional information about the package not available with traditional static…
We present a simple measurement and analysis technique to determine the fraction of optical loss due to both radiation (scattering) and linear absorption in microphotonic components. The method is generally applicable to optical materials…
Thermal FEM (Finite Element Method) simulations can be used to predict the thermal behavior of power semiconductors in application. Most power semiconductors are made of silicon. Silicon thermal material properties are significantly…
The method consists in the monitoring of the temperature variation of a superconductor tape subjected to a trapezoidal current pulse. Simulations of the experiment were performed using the lumped capacitance model and also the finite…
Low-cost thermal cameras are inaccurate (usually $\pm 3^\circ C$) and have space-variant nonuniformity across their detector. Both inaccuracy and nonuniformity are dependent on the ambient temperature of the camera. The goal of this work…
Fine-grained power estimation in multicore Systems on Chips (SoCs) is crucial for efficient thermal management. BPI (Blind Power Identification) is a recent approach that determines the power consumption of different cores and the thermal…
Low-loss nanophotonic resonators have been widely used in fundamental science and applications thanks to their ability to concentrate optical energy. Key for resonator engineering, the total intrinsic loss is easily determined by…
Ellipsometry is a powerful and well-established optical technique used in the characterisation of materials. It works by combining the components of elliptically polarized light in order to draw information about the optical system. We…