Related papers: Component-wise Power Estimation of Electrical Devi…
Power efficiency is a crucial consideration for embedded systems design, particularly in the field of edge computing and IoT devices. This study aims to calibrate the power measurements obtained from the built-in sensors of NVIDIA Jetson…
Thermodynamic parameters such as temperature and pressure can be defined from the statistical behavior of a system. Therefore, thermal fluctuation is an inseparable characteristic of these parameters which eventually finds its way into…
Our paper presents a non-destructive thermal transient measurement method that is able to reveal differences even in the micron size range of MEMS structures. Devices of the same design can have differences in their sacrificial layers as…
We explore the possibility to perform an in-situ transmission electron microscopy (TEM) thermoelectric characterization of materials. A differential heating element on a custom in-situ TEM microchip allows to generate a temperature gradient…
State-space representation is essential in the theory of dynamic systems. This paper introduces a methodology for obtaining state-space representation from the thermal models of elementary components of a building by the conjunction of two…
Power consumption and heat dissipation become key elements in the field of high-end integrated circuits, especially those used in mobile and high-speed applications, due to their increase of transistor count and clock frequencies. Dynamic…
Photonic integrated circuits play an important role in the field of optical computing, promising faster and more energy-efficient operations compared to their digital counterparts. This advantage stems from the inherent suitability of…
High voltage insulators are widely deployed in power systems to isolate the live- and dead-part of overhead lines as well as to support the power line conductors mechanically. Permanent, secure and safe operation of power transmission lines…
In many applications of absorbing structures it is important to understand their spatial response to incident fields, for example in thermal solar panels, bolometric imaging and controlling radiative heat transfer. In practice, the…
In this article, a general model for 1D thermal wave interference is derived for multi-layered coating systems on a thermally thick substrate using the same principles as for the well established one-layered and two-layered coating cases.…
A thermal position sensor was fabricated and evaluated. The device consists of an array of temperature sensing elements, fabricated entirely on a plastic substrate. A novel fabrication technology was implemented which allows direct…
At the ultra-thin limit below 20 nm, a film's electrical conductivity, thermal conductivity, or thermoelectricity depends heavily on its thickness. In most studies, each sample is fabricated one at a time, potentially leading to…
Due to the growing concern of chronic diseases and other health problems related to diet, there is a need to develop accurate methods to estimate an individual's food and energy intake. Measuring accurate dietary intake is an open research…
The paper describes a method for measuring the thermal diffusivity of materials having a high thermal conductivity. The apparatus is rather simple and low-cost, being therefore suitable in a laboratory for undergraduate students of…
The paper describes the realization process of the high frequency power standard based on a twin broadband microcalorimeter designed for effective efficiency measurement of coaxial power sensors with indirect heating thermocouples. The…
Cutting edge FPGAs are not energy efficient as conventionally presumed to be, and therefore, aggressive power-saving techniques have become imperative. The clock rate of an FPGA-mapped design is set based on worst-case conditions to ensure…
One of the key design choices of any sampling calorimeter is how fine to make the longitudinal and transverse segmentation. To inform this choice, we study the impact of calorimeter segmentation on energy reconstruction. To ensure that the…
Quantifying the temperature of microdevices is critical for probing nanoscale energy transport.Such quantification is often accomplished by integrating resistance thermometers into microdevices. However, such thermometers frequently become…
Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stacked) and lateral arrangement. In our present study we show…
In this paper we summarize several applications based on thermal imaging. We emphasize the importance of emissivity adjustment for a proper temperature measurement. A new set of face images acquired at different emissivity values with steps…