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Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
Silicon photonic integration has gained great success in many application fields owing to the excellent optical device properties and complementary metal-oxide semiconductor (CMOS) compatibility. Realizing monolithic integration of III-V…
Semiconductor research has shifted towards exploring two-dimensional (2D) materials as candidates for next-generation electronic devices due to the limitations of existing silicon technology. Transition Metal Dichalcogenides (TMDCs) stand…
Atomically thin semiconductors have versatile future applications in the information and communication technologies for the ultimate miniaturization of electronic components. In particular, the ongoing research demands not only a…
Two dimensional (2D) integration has been the traditional approach for IC integration. Due to increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages, has driven…
Stacked intelligent metasurfaces (SIMs) have recently gained attention as a paradigm for wave-domain signal processing with reduced reliance on costly radio-frequency (RF) chains. However, conventional SIMs rely on uniform inter-layer…
Data are presented on mutual and self-inductance of various inductors used in multilayered superconductor integrated circuits: microstrips and striplines with widths of signal traces from 250 nm to a few micrometers, located on the same…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
The increasing demand for controllable outputs in text-to-image generation has spurred advancements in multi-instance generation (MIG), allowing users to define both instance layouts and attributes. However, unlike image-conditional…
In multilevel 3D integrated packaging, three major microstructures are viable due to the application of low volume of solders in different sizes, and/or processing conditions. Thermodynamics and kinetics of binary compounds in Cu/Sn/Cu low…
In this work, we study underlay radar-massive MIMO cellular coexistence in LoS/near-LoS channels, where both systems have 3D beamforming capabilities. Using mathematical tools from stochastic geometry, we derive an upper bound on the…
High-quality dielectric-semiconductor interfaces are critical for reliable high-performance transistors. We report the in-situ metalorganic chemical vapor deposition (MOCVD) of Al$_2$O$_3$ on $\beta$-Ga$_2$O$_3$ as a potentially better…
In this work, a novel one-dimensional geometry for metal-insulator-graphene (1D-MIG) diode with low capacitance is demonstrated. The junction of the 1D-MIG diode is formed at the 1D edge of Al2O3-encapsulated graphene with TiO2 that acts as…
Fixed-complexity Sphere Decoder (FSD) is a recently proposed technique for Multiple-Input Multiple-Output (MIMO) detection. It has several outstanding features such as constant throughput and large potential parallelism, which makes it…
A fabrication process has been developed for fully planarized Nb-based superconducting inter-layer connections (vias) with minimum size down to 250 nm for superconductor very large scale integrated (VLSI) circuits with 8 and 10…
Singular value decomposition (SVD) is widely used in wireless systems, including multiple-input multiple-output (MIMO) processing and dimension reduction in distributed MIMO (D-MIMO). However, the iterative nature of decomposition methods…
Waveguide crossings represent one of the most critical components in very-large-scale photonic integration (VLSPI). Three-dimensional waveguide crossings, which distribute optical pathways across multiple planes, can achieve near-zero…
In-cache computing technology transforms existing caches into long-vector compute units and offers low-cost alternatives to building expensive vector engines for mobile CPUs. Unfortunately, existing long-vector Instruction Set Architecture…
Monolithic three-dimensional integration of memory and logic circuits could dramatically improve performance and energy efficiency of computing systems. Some conventional and emerging memories are suitable for vertical integration,…
Scaling trapped-ion quantum computing will require robust trapping of at least hundreds of ions over long periods, while increasing the complexity and functionality of the trap itself. Symmetric 3D structures enable high trap depth, but…