Related papers: Defect Localization in Flip-Chip Devices Using Spa…
Magnetic current imaging (MCI) is useful for non-destructive characterization of microelectronics, including both security analysis and failure analysis, because magnetic fields penetrate the materials that comprise these components to…
As integrated circuit (IC) geometry and packaging become more sophisticated with ongoing fabrication and design innovations, the electrical engineering community needs increasingly-powerful failure analysis (FA) methods to meet the growing…
In semiconductor manufacturing, defect detection and localization are critical to ensuring product quality and yield. While X-ray imaging is a reliable non-destructive testing method, it is memory-intensive and time-consuming for…
Electromagnetic Fault Injection (EMFI) is a powerful technique for inducing bit flips and instruction-level perturbations on microcontrollers, yet existing literature lacks a unified methodology for systematically mapping spatial…
Niobium-based Superconducting Radio Frequency (SRF) cavity performance is sensitive to localized defects that give rise to quenches at high accelerating gradients. In order to identify these material defects on bulk Nb surfaces at their…
In semiconductor packaging, accurately recovering 3D information is crucial for non-destructive testing (NDT) to localize circuit defects. This paper presents a novel approach called the 3D Magnetic Inverse Routine (3D MIR), which leverages…
With the wide application of electric energy storage component arrays, such as battery arrays, capacitor arrays, inductor arrays, their potential safety risks have gradually drawn the public attention. However, existing technologies cannot…
We present a novel technique based on an ensemble of Nitrogen-Vacancy (NV) centers in diamond to perform Magnetic Current Imaging (MCI) on an Integrated Circuit (IC). NV centers in diamond allow measuring the three components of the…
In electromagnetic simulations of magnets and machines one is often interested in a highly accurate and local evaluation of the magnetic field uniformity. Based on local post-processing of the solution, a defect correction scheme is…
Dynamic functional connectivity (dFC) using resting-state functional magnetic resonance imaging (rs-fMRI) is an advanced technique for capturing the dynamic changes of neural activities, and can be very useful in the studies of brain…
The adoption of 3D packaging technology necessitates the development of new approaches to failure electronic device analysis. To that end, our team is developing a tool called the quantum diamond microscope (QDM) that leverages an ensemble…
Non-destructive eddy current testing of defects in metal plates using the magnetic resonance signal of a radio-frequency atomic magnetometer is demonstrated. The shape and amplitude of the spatial profile of signal features that correspond…
This paper develops a fault detection and identification (FDI) method for nonlinear control-affine systems under simultaneous actuator and sensor faults. We adopt a geometric approach to study the isolability of faults in the sense of the…
Band bending is a central concept in solid-state physics that arises from local variations in charge distribution especially near semiconductor interfaces and surfaces. Its precision measurement is vital in a variety of contexts from the…
Magnetic Resonance Imaging (MRI) is universally acknowledged as an excellent tool to extract detailed spatial information with minimally invasive measurements. Efforts toward ultra-low-field (ULF) MRI are made to simplify the scanners and…
Magnetic particle imaging (MPI) is a tracer-based imaging modality that detects superparamagnetic iron oxide nanoparticles in vivo, with applications in cancer cell tracking, lymph node mapping, and cell therapy monitoring. We introduce a…
Current density distributions in active integrated circuits (ICs) result in patterns of magnetic fields that contain structural and functional information about the IC. Magnetic fields pass through standard materials used by the…
Real-space mapping of doping concentration in semiconductor devices is of great importance for the microelectronic industry. In this work, a scanning microwave impedance microscope (MIM) is employed to resolve the local conductivity…
Surface based geometries of microfabricated wires or patterned magnetic films can be used to magnetically trap and manipulate ultracold neutral atoms or Bose-Einstein condensates. We investigate the magnetic properties of such atom chips…
The development of advanced packaging is essential in the semiconductor manufacturing industry. However, non-destructive testing (NDT) of advanced packaging becomes increasingly challenging due to the depth and complexity of the layers…