Related papers: Boosting the 3D thermal-aware floorplanning proble…
Monte Carlo Localization is a widely used approach in the field of mobile robotics. While this problem has been well studied in the 2D case, global localization in 3D maps with six degrees of freedom has so far been too computationally…
Parallel implementation of numerical adaptive mesh refinement (AMR)strategies for solving 3D elastostatic contact mechanics problems is an essential step toward complex simulations that exceed current performance levels. This paper…
We present a new technique of VLSI chip-level thermal analysis. We extend a newly developed method of solving two dimensional Laplace equations to thermal analysis of four adjacent materials on a mother board. We implement our technique in…
Continent-scale datasets challenge hydrological algorithms for processing digital elevation models. Flow accumulation is an important input for many such algorithms; here, I parallelize its calculation. The new algorithm works on one or…
Simulated annealing is an effective and general means of optimization. It is in fact inspired by metallurgy, where the temperature of a material determines its behavior in thermodynamics. Likewise, in simulated annealing, the actions that…
The memory hierarchy has a high impact on the performance and power consumption in the system. Moreover, current embedded systems, included in mobile devices, are specifically designed to run multimedia applications, which are memory…
A chiplet is an integrated circuit that encompasses a well-defined subset of an overall system's functionality. In contrast to traditional monolithic system-on-chips (SoCs), chiplet-based architecture can reduce costs and increase…
We propose three semi-decoupled algorithms for efficiently solving a four-field thermoporoelastic model. The first two algorithms adopt a sequential strategy: at the initial time step, all variables are computed simultaneously using a…
Different factors such as thermal comfort, humidity, air quality, and noise have significant combined effects on the acceptability and quality of the activities performed by the building occupants who spend most of their times indoors.…
Expert Parallelism (EP) permits Mixture of Experts (MoE) models to scale beyond a single GPU. To address load imbalance across GPUs in EP, existing approaches aim to balance the number of tokens each GPU processes. Surprisingly, we find…
Dedicated hardware accelerators are suitable for parallel computational tasks. Moreover, they have the tendency to accept inexact results. These hardware accelerators are extensively used in image processing and computer vision…
Parallel-elastic joints can improve the efficiency and strength of robots by assisting the actuators with additional torques. For these benefits to be realized, a spring needs to be carefully designed. However, designing robots is an…
Driven by artificial intelligence, data science, and high-resolution simulations, I/O workloads and hardware on high-performance computing (HPC) systems have become increasingly complex. This complexity can lead to large I/O overheads and…
In the elevator industry, reducing passenger journey time in an elevator system is a major aim. The key obstacle to optimising elevator dispatching is the unpredictable traffic flow of passengers. To address this difficulty, two main…
In this paper, we propose an efficient parallelization strategy for boundary element method (BEM) solvers that perform the electromagnetic analysis of structures with lossy conductors. The proposed solver is accelerated with the adaptive…
Metaheuristic algorithms are widely used for solving complex problems due to their ability to provide near-optimal solutions. But the execution time of these algorithms increases with the problem size and/or solution space. And, to get more…
Floorplanning is the first stage of VLSI physical design. An effective floorplanning engine definitely has positive impact on chip design speed, quality and performance. In this paper, we present a novel mathematical model to characterize…
With the advent of the post-Moore era, the 2.5-D advanced package is a promising solution to sustain the development of very large-scale integrated circuits. However, the thermal placement of chiplet, due to the high complexity of thermal…
We propose in this paper to study the energy-, thermal- and performance-aware resource management in heterogeneous datacenters. Witnessing the continuous development of heterogeneity in datacenters, we are confronted with their different…
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…