Related papers: Chemical Mechanical Planarization for Ta-based Sup…

As time-to-market is crucial in the Integrated Circuit (IC) industry, speeding up layout manufacturability verifi-cation is essential. Chemical-Mechanical Polishing (CMP) plays a vital role in IC fabrication but is significantly influenced…

Three-dimensional (3D) photonic integrated circuits (PIC) are emerging as an indispensable scheme for high density and multifunctional photonic systems. However, the wafer-scale scaling of PICs towards a 3D configuration is constrained by…

Here we demonstrate that adding a chemo-mechanical polishing (CMP) procedure to conventional photolithography, a silica microdisk with ultra-high quality factors ($>10^8$) can be fabricated. By comparing with the intrinsic optical quality…

A new fabrication process for superconducting integrated digital circuits is reported. We have developed the "SIMIT Nb04" fabrication technique for superconducting integrated circuits with Nb-based Josephson junctions based on the validated…

Tantalum (Ta) has recently received considerable attention in manufacturing robust superconducting quantum circuits. Ta offers low microwave loss, high kinetic inductance compared to aluminium (Al) and niobium (Nb), and good compatibility…

High-fidelity numerical methods that model the physical layout of a device are essential for the design of many technologies. For methods that characterize electromagnetic effects, these numerical methods are referred to as computational…

In this article, we present a technology development of a superconducting qubit device 3D-integrated by flip-chip-bonding and processed following CMOS fabrication standards and contamination rules on 200 mm wafers. We present the utilized…

Utilizing tantalum (Ta) in superconducting circuits has led to significant improvements, such as high qubit lifetimes and quality factors in both qubits and resonators, underscoring the importance of material optimization in quantum device…

Advanced integration technologies greatly enhance the prospects and reliability of practical quantum sensors, atomic clocks, and quantum information technologies. The performance and proliferation of these devices at chip-scale is…

We present full-sky maps of the cosmic microwave background (CMB) and polarized synchrotron and thermal dust emission, derived from the third set of Planck frequency maps. These products have significantly lower contamination from…

Proper quality control (QC) is time consuming when working with large-scale medical imaging datasets, yet necessary, as poor-quality data can lead to erroneous conclusions or poorly trained machine learning models. Most efforts to reduce…

Silicon photonic devices fundamental to high-density wavelength-division multiplexed (DWDM) optical links and photonic switching networks, such as resonant modulators and Mach-Zehnder interferometers (MZIs), are highly sensitive to…

We present results of a planar process development based on the combination of electron-beam lithography and dry etching for fabricating high-quality superconducting photosensitive structures in the sub-100nm regime. The devices were…

Disorder induced phase slip (PS) events appearing in the current voltage characteristics (IVCs) are reported for two-dimensional TiN thin films produced by a robust substrate mediated nitridation technique. Here, high temperature annealing…

Scaling superconducting digital circuits requires fundamental changes in the current material set and fabrication process. The transition to 300 mm wafers and the implementation of advanced lithography are instrumental in facilitating…

We present a CMB large-scale polarization dataset obtained by combining WMAP Ka, Q and V with Planck 70 GHz maps. We employ the legacy frequency maps released by the WMAP and Planck collaborations and perform our own Galactic foreground…

We review the salient features of two advanced nodes of an 8-Nb-layer fully planarized process developed recently at MIT Lincoln Laboratory for fabricating Single Flux Quantum(SFQ) digital circuits with very large scale integration on…

Stressed nanomechanical resonators are known to have exceptionally high quality factors ($Q$) due to the dilution of intrinsic dissipation by stress. Typically, the amount of dissipation dilution and thus the resonator $Q$ is limited by the…

Compact and robust waveguide chips are crucial for new integrated terahertz applications, such as high-speed interconnections between processors and broadband short-range wireless communications. Progress on topological photonic crystals…

Large language models (LLMs) demand significant memory and computation resources. Wafer-scale chips (WSCs) provide high computation power and die-to-die (D2D) bandwidth but face a unique trade-off between on-chip memory and compute…