Related papers: Three-dimensional integration enables ultra-low-no…
The development of integrated semiconductor lasers has miniaturized traditional bulky laser systems, enabling a wide range of photonic applications. A progression from pure III-V based lasers to III-V/external cavity structures has…
3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Bandwidth Memory (HBM). However, the copper-based electrical…
We investigate theoretically photonic chips with monolithically integrated blue light sources. According to our evaluations, a group-III nitride light emitting heterostructure can be efficiently combined with silicon nitride waveguiding…
Combining optical gain in direct-bandgap III-V materials with tunable optical feedback offered by advanced photonic integrated circuits is key to chip-scale external-cavity lasers (ECL), offering wideband tunability along with low optical…
Photonic integrated circuits (PICs) are key in advancing quantum technologies for secure communications. They offer inherent stability, low losses and compactness compared to standard fiber-based and free-space systems. Our reasearch…
Photonic Integrated Circuits (PICs) offer tremendous advantages in bandwidth, parallelism, and energy efficiency, making them essential for emerging applications in artificial intelligence (AI), high-performance computing (HPC), sensing,…
Non-classical light sources offer a myriad of possibilities in fundamental science and applications including quantum cryptography and quantum lithography. Single photons can encode quantum information and multi-qubit gates in silica…
We present an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature. All lithography is performed with a 365 nm i-line stepper, facilitating…
Future space-ground communication networks require a seamless fusion of technologies that combine the all-weather reliability of microwave links with the ultra-high data capacity of near-infrared optical systems. Achieving this vision…
Waves that are perfectly confined in the continuous spectrum of radiating waves without interaction with them are known as bound states in the continuum (BICs). Despite recent discoveries of BICs in nanophotonics, full routing and control…
Optical computing with integrated photonics brings a pivotal paradigm shift to data-intensive computing technologies. However, the scaling of on-chip photonic architectures using spatially distributed schemes faces the challenge imposed by…
Photonic miniaturization requires seamless integration of linear and nonlinear optical components to achieve passive and active functions simultaneously. Among the available material systems, silicon photonics holds immense promise for…
Microwave-frequency acoustic waves in solids have emerged as a versatile platform for both classical and quantum applications. While phononic integrated devices and circuits are being developed on various material platforms, an ideal…
Integrated photonics has recently become a leading platform for the realization and processing of optical entangled quantum states in compact, robust and scalable chip formats with applications in long-distance quantum-secured…
Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities across diverse fields ranging from fundamental science [1] to medicine [2] and environmental science [3] by leveraging advanced…
Photonic integrated circuits route and shape light on a chip, but back-reflections feed back into coherent on-chip lasers, destabilizing operation and corrupting signals. Robust operation requires an integrated optical isolator that…
Integrated lithium niobate (LN) photonics is a promising platform for future chip-scale microwave photonics systems owing to its unique electro-optic properties, low optical loss and excellent scalability. A key enabler for such systems is…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
The emerging hybrid integrated quantum photonics combines advantages of different functional components into a single chip to meet the stringent requirements for quantum information processing. Despite the tremendous progress in hybrid…
The inverse design of photonic integrated circuits (PICs) presents distinctive computational challenges, including their large memory requirements. Advancements in the two-photon polymerization (2PP) fabrication process introduce additional…