Related papers: Pixel detector hybridisation with Anisotropic Cond…
We present a smart pixel prototype readout integrated circuit (ROIC) designed in CMOS 28 nm bulk process, with in-pixel implementation of an artificial intelligence (AI) / machine learning (ML) based data filtering algorithm designed as…
Scientific detectors are a key technological enabler for many disciplines. Application-specific integrated circuits (ASICs) are used for many of these scientific detectors. Until recently, pixel detector ASICs have been used mainly for…
The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um, required in these applications, cannot…
Studies of a single photon counting hybrid pixel detector for X-ray imaging applications are presented. A silicon- and a CdTe-sensor were bump bonded onto the MPEC pixel readout chip and could be successfully operated. A new USB based…
Monolithic active pixel sensors (MAPS) produced in a 65 nm CMOS imaging technology are being investigated for applications in particle physics. The MAPS design has a small collection electrode characterized by an input capacitance of ~fF,…
In order to fully exploit the physics potential of a e+e- linear collider, such as TESLA, a Vertex Tracker providing high resolution track reconstruction is required. Hybrid Silicon pixel sensors are an attractive sensor technology option…
Over the past few years we have developed, in collaboration with the SARNOFF Corporation, a design of a Monolithic CMOS Pixel Detector for ILC Vertex Detectors. The unique feature of this design is that each hit is accompanied by a time tag…
The M\"ONCH hybrid pixel detector, with a 25 \textmu m pixel pitch and fast charge-integrating readout, has demonstrated subpixel resolution capabilities for X-ray imaging and deep learning-based electron localization in electron…
3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are…
The capacitance of the charge collection node of a sensor system is an important parameter for the design of the analog front-end electronics. The analog front-end of high-granularity sensors like for example hybrid pixel detectors need to…
The High Energy Photon Source (HEPS) represents a fourth-generation light source. This facility has made unprecedented advancements in accelerator technology, necessitating the development of new detectors to satisfy physical requirements…
Artificial Intelligence is poised to transform the design of complex, large-scale detectors like the ePIC at the future Electron Ion Collider. Featuring a central detector with additional detecting systems in the far forward and far…
The performance of novel n-in-p planar pixel detectors, designed for future upgrades of the ATLAS Pixel system is presented. The n-in-p silicon sensors technology is a promising candidate for the pixel upgrade thanks to its radiation…
The ATLAS experiment at the LHC will replace its current inner tracker system for the HL-LHC era. 3D silicon pixel sensors are being considered as radiation-hard candidates for the innermost layers of the new fully silicon-based tracking…
The lack of energy dissipation and abrupt electrical phase transition of superconductors favorite them for nanoscale technologies, including radiation detectors, and quantum technologies. Moreover, understanding the nanoscale behavior of…
Silicon detectors have gained in popularity since silicon became a widely used micro/nanoelectronic semiconductor material. Silicon detectors are used in particle physics as well as imaging for pixel based detecting systems. Over the past…
The high-luminosity upgrade of the CERN LHC requires the replacement of the CMS tracking detector to cope with the increased radiation fluence while maintaining its excellent performance. An extensive R\&D program, aiming at using 3D pixel…
The silicon pixel detector (SPD) of the ALICE experiment in preparation at the Large Hadron Collider (LHC) at CERN is designed to provide the precise vertex reconstruction needed for measuring heavy flavor production in heavy ion collisions…
The European X-ray Free Electron Laser (XFEL) is a new research facility currently under construction in Hamburg, Germany. With a pulse length of less than 100 fs and an extremely high luminosity of 27000 flashes per second the European…
CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a…