Related papers: ReSiPI: A Reconfigurable Silicon-Photonic 2.5D Chi…
Photonic integrated circuits utilize various waveguide materials, each excelling in specific metrics like efficient light emission, low propagation loss, high electro-optic efficiency, and potential for mass production. Inherent…
Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…
Optical I/O technologies have emerged as a potential industrial solution for high-performance data interconnection in AI/ML computing acceleration. While optical I/Os are deployed at the edge of computational chips by co-packaged optics…
2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects (ICIs). As the number of chiplets…
As we move towards an era of hundreds of cores, the research community has witnessed the emergence of opto-electronic network on-chip designs based on nanophotonics, in order to achieve higher network throughput, lower latencies, and lower…
Modern machine learning (ML) applications are becoming increasingly complex and monolithic (single chip) accelerator architectures cannot keep up with their energy efficiency and throughput demands. Even though modern digital electronic…
In the wake of dwindling Moore's Law, to address the rapidly increasing complexity and cost of fabricating large-scale, monolithic systems-on-chip (SoCs), the industry has adopted dis-aggregation as a solution, wherein a large monolithic…
Traditional silicon-on-insulator (SOI) platform based on-chip photonic interconnects have limited energy-bandwidth scalability due to the optical non-linearity induced power constraints of the constituent photonic devices. In this paper, we…
3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Bandwidth Memory (HBM). However, the copper-based electrical…
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-chiplet interconnect…
Multi-chiplet architectures enabled by glass interposer offer superior electrical performance, enable higher bus widths due to reduced crosstalk, and have lower capacitance in the redistribution layer than current silicon interposer-based…
Achieving non-reciprocal optical behavior in integrated photonics with high efficiency has long been a challenge. Here, we demonstrate a non-reciprocal magneto-optic response by integrating multilayer 2D CuCrP2S6 (CCPS) onto silicon micro…
With the growing need for higher memory bandwidth and computation density, 2.5D design, which involves integrating multiple chiplets onto an interposer, emerges as a promising solution. However, this integration introduces significant…
Heterogeneous chiplets have been proposed for accelerating high-performance computing tasks. Integrated inside one package, CPU and GPU chiplets can share a common interconnection network that can be implemented through the interposer.…
In this paper, we present a reconfigurable hybrid Photonic-Plasmonic Network-on-Chip (NoC) based on the Dynamic Data Driven Application System (DDDAS) paradigm. In DDDAS computations and measurements form a dynamic closed feedback loop in…
DSP (digital signal processing) has been widely applied in optical communication systems to mitigate signal distortions and has become one of the key technologies that have sustained data traffic growth over the past decade. However, the…
Panel-scale reconfigurable photonic interconnects on a glass substrate up to 500-mm x 500-mm or larger are envisioned by proposing a novel photonic switch fabric that enables all directional panel-edge-to-panel-edge reach without the need…
The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via various inter-chiplet connection and heterogeneous integration. However, it is not known how to convert such flexibility into cost efficiency, which is…
Optics offers unique opportunities for reducing energy in information processing and communications while resolving the problem of interconnect bandwidth density inside machines. Such energy dissipation overall is now at environmentally…
Due to reduced manufacturing yields, traditional monolithic chips cannot keep up with the compute, memory, and communication demands of data-intensive applications, such as rapidly growing deep neural network (DNN) models. Chiplet-based…