Related papers: Timing performance of the Timepix4 front-end

The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;\mu\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole…

We present the timing characteristics of the flash ADC readout of the GlueX forward calorimeter, which depends on precise measurement of arrival time of pulses from FEU 84-3 photomultiplier tubes to suppress backgrounds. The tests presented…

For the advancement of the understanding of timing systematics in pixelized readout chips and for the benefit of future fast timing detectors to aid 4D tracking technology in the HL-LHC, we have performed detailed studies of the timing…

We present a readout chip prototype for future pixel detectors with timing capabilities. The prototype is intended for characterizing 4D pixel arrays with a pixel size of $100\times100~\mu \text{m}^2$, where the sensors are Low Gain…

Time-digital Converter (TDC) aims to measure the arrival time of the leading edge of the pulse signal. Our recent work presented a high resolution multi-phase TDC based on the Kintex-7 Field Programmable Gate Array (FPGA) device. A simple…

This paper presents the design and testing of a time-stretching-based time-to-digital converter (TDC) implemented with discrete components. The TDC utilizes capacitor charging and discharging to achieve a time resolution of under 100 ps…

Timepix3 is a multi-purpose readout ASIC for hybrid pixel detectors. It can measure time and energy simultaneously by employing time-of-arrival (ToA) and time-over-threshold (ToT) techniques. Both methods are systematically affected by…

We present a novel single-photon detector based on a vacuum tube incorporating a photocathode, a microchannel plate (MCP), and a Timepix4 CMOS ASIC functioning as a pixelated anode. Designed to handle photon rates up to 1 billion per second…

Test beam measurements have been carried out with a 3D sensor on a Timepix3 ASIC and the time measurements are presented. The measurements are compared to those of a thin planar sensor on Timepix3. It is shown that for a perpendicularly…

In this paper we present a novel high-resolution multi-channel FPGA-based time-to-digital converter (TDC). We designed and implemented a complex electronic circuit on the FPGA, whose overall accuracy is several orders of magnitude greater…

Timing-pick up detectors with excellent timing resolutions are essential in many modern nuclear physics experiments. Aiming to develop a Time-Of-Flight system with precision down to about 10 ps, we have made a systematic study of the timing…

We present the prototype of a time-to-digital (TDC) ASIC for the upgrade of the ATLAS Monitored Drift Tube (MDT) detector for high-luminosity LHC operation. This ASIC is based on a previously submitted demonstrator ASIC designed for timing…

We have developed a Time-to-Digital Converter (TDC) application in a Xilinx Kintex-7 Field Programmable Gate Array (FPGA). This TDC, based on the Tapped-Delay Line (TDL) and Wave Union A (WU-A) techniques, achieves an independent time…

A high precision and high resolution time-to-digital converter (TDC) implemented in a 40 nm fabrication process Virtex-6 FPGA is presented in this paper. The multi-chain measurements averaging architecture is used to overcome the resolution…

The time resolution of the second monolithic silicon pixel prototype produced for the MONOLITH H2020 ERC Advanced project was studied using a femtosecond laser. The ASIC contains a matrix of hexagonal pixels with 100 {\mu}m pitch, readout…

The spatial and temporal performance of a telescope system comprising planar silicon sensors bump-bonded to Timepix4-v2 ASICs are assessed at the CERN SPS using a $180$~GeV/$c$ mixed hadron beam. The pointing resolution at the centre of the…

First measurements are presented from a newly commissioned two-photon absorption (TPA) setup at Nikhef. The characterisation of the various components of the system is discussed. Two planar silicon sensors, one being electron collecting and…

In the context of the CERN EP R&D on monolithic sensors and the ALICE ITS3 upgrade, the Tower Partners Semiconductor Co (TPSCo) 65 nm process has been qualified for use in high energy physics, and adopted for the ALICE ITS3 upgrade. An…

A high-precision charge measurement can be achieved by the area integration of a digitized quasi-Gaussian signal after the signal passes through the shaper and analog-to-digital converter (ADC). The charge measurement contains an error due…

SiGe BiCMOS technology can be used to produce ultra-fast, low-power silicon pixel sensors that provide state-of-the-art time resolution even without an internal gain mechanism. The development of such sensors requires the identification of…