Related papers: Integration and Packaging
Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been…
Hybrid circuit quantum electrodynamics (cQED) aims at coupling various quantum degrees of freedom, among which are spin and charge degrees of freedom in gate defined quantum dots, phonons or magnons... with quantized electromagnetic fields…
A new type of integrated polarizer based on bent coupled optical waveguides is proposed. The simplicity of the device geometry permits its realization using only basic standard fabrication steps. A deep etched waveguide silicon nitride…
We report on studies of vertically interconnected electronics (3D) performed by the Fermilab pixel group over the past two years. These studies include exploration of interconnect technology, backside thinning and laser annealing, the…
In the construction of High-Luminosity Large Hadron Collider (HL-LHC) and Future Circular Collider (FCC) experiments, 3D pixel sensors have become indispensable components due to their superior radiation hardness, fast response, and low…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
We present a compact setup based on a three-dimensional integrated optical component, allowing the mea- surement of spectrally resolved complex-visibilities for three channels of polychromatic light. We have tested a prototype of the…
In order to fully exploit the physics potential of the future high energy e+ e- linear collider, a Vertex Tracker providing high resolution track reconstruction is required. Hybrid pixel sensors are an attractive technology due to their…
3D vision is of paramount importance for numerous applications ranging from machine intelligence to precision metrology. Despite much recent progress, the majority of 3D imaging hardware remains bulky and complicated and provides much lower…
Significant progress has been made to develop silicon pixel technologies for use in the vertex and tracker regions of the proposed Compact Linear Collider (CLIC) detector design. The electron-positron collisions generated by this linear…
Hybridization of pixel detector systems has to satisfy tight requirements: high yield, long term reliability, mechanical stability, thermal compliance and robustness have to go together with low passive mass added to the system, radiation…
Photonic Integrated Circuits (PICs) offer transformative potential for computing systems, enabling high-bandwidth neuromorphic processors and facilitating low decoherence quantum computing on a chip scale platform. However, the development…
The demands on detectors for particle detection as well as for medical and astronomical X-ray imaging are continuously pushing the development of novel pixel detectors. The state of the art in pixel detector technology to date are hybrid…
Three-dimensional self-assembly of lithographically patterned ultrathin films opens a path to manufacture microelectronic architectures with functionalities and integration schemes not accessible by conventional two-dimensional…
Lanthanide-based emitters are attracting increasing interest for their potential in high-performance OLEDs due to their narrow emission bands, high photostability, and functional versatility. However, their low radiative rates and poor…
The rapid development of quantum information processors has accelerated the demand for technologies that enable quantum networking. One promising approach uses mechanical resonators as an intermediary between microwave and optical fields.…
Recent advances in photonic integration have propelled microwave photonic technologies to new heights. The ability to interface hybrid material platforms to enhance light-matter interactions has led to the developments of ultra-small and…
Object detection and global localization play a crucial role in robotics, spanning across a great spectrum of applications from autonomous cars to multi-layered 3D Scene Graphs for semantic scene understanding. This article proposes BOX3D,…
In this work we explore monolithic opto-electronic integration platform for significant down-scaling of input-referred noise in custom designed low-noise analog front-end used for balanced photodetection. The performance of such…
Several Scientific and engineering applications require merging of sampled images for complex perception development. In most cases, for such requirements, images are merged at intensity level. Even though it gives fairly good perception of…