Related papers: Dialing back time on Timepix3: A study on the timi…

The ZEUS Central Tracking Detector utilizes a time difference measurement to provide a fast determination of the z-coordinate of each hit. The z-by-timing measurement is achieved by using a Time-to-Amplitude Converter which has an intrinsic…

The experiments at LHC are implementing novel and challenging detector upgrades for the High Luminosity LHC, among which the tracking systems. This paper reports on performance studies, illustrated by an electron trigger, using a simplified…

The M\"ONCH hybrid pixel detector, with a 25 \textmu m pixel pitch and fast charge-integrating readout, has demonstrated subpixel resolution capabilities for X-ray imaging and deep learning-based electron localization in electron…

A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a significantly…

We have developed a new laser-based time calibration system for highly segmented scintillator counters like the MEG II pixelated Timing Counter (pTC), consisting of 512-centimeter scale scintillator counters read out by silicon…

Significant progress has been made to develop silicon pixel technologies for use in the vertex and tracker regions of the proposed Compact Linear Collider (CLIC) detector design. The electron-positron collisions generated by this linear…

This study investigates the response of Timepix3 semiconductor pixel detectors in proton beams of varying intensities, with a focus on FLASH proton therapy. Using the Timepix3 ASIC chip, we measured the spatial and spectral characteristics…

The High Luminosity LHC (HL-LHC) upgrade requires the planned Inner Tracker (ITk) of the ATLAS detector to tolerate extremely high radiation doses. Specifically, the innermost parts of the pixel system will have to withstand radiation…

The current CMS silicon pixel detector as the innermost component of the CMS experiment is performing well at LHC design luminosity, but would be subject to severe inefficiencies at LHC peak luminosities of 2x10e34 cm^-2 s^-1. Therefore, an…

The next generation of collider experiments require tracking detectors with extreme performance capabilities in terms of spatial resolution (tens of $\mu \text{m}$), radiation hardness ($10^{17}~1~$MeV n$_{eq}/$cm$^2$) and timing resolution…

Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel…

Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders requires the use of time information in tracking, due to the increasing levels…

The proposed Circular Electron Positron Collider (CEPC) imposes new challenges for the vertex detector in terms of pixel size and material budget. A Monolithic Active Pixel Sensor (MAPS) prototype called TaichuPix, based on a column drain…

The timing performance of silicon sensors bump-bonded to Timepix3 ASICs is investigated, prior to and after different types of irradiation up to $8 \times 10^{15} 1 \mathrm{\,Me\kern -0.1em V} \mathrm{ \,n_{eq}} {\mathrm{ \,cm}}^{-2}$. The…

The ATLAS experiment at the LHC will replace its current inner tracker system for the HL-LHC era. 3D silicon pixel sensors are being considered as radiation-hard candidates for the innermost layers of the new fully silicon-based tracking…

The PhaseII Upgrades of CMS are being planned for the High Luminosity LHC (HL-LHC) era when the mean number of interactions per beam crossing ("in-time pileup") is expected to reach ~140-200. The potential backgrounds arising from…

Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about…

3D imaging is increasingly impacting areas such as space, defense, automation, medical and automotive industries. The most well-known optical 3D imaging systems are LIDAR systems that rely on Time of Flight (ToF) measurement. The depth…

To cope with the higher occupancy and radiation damage at the HL-LHC also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project (PPS) is an international collaboration of 17 institutions and more than 80…

The DESY digital silicon photomultiplier (dSiPM) is a monolithic detector based on complementary metal-oxide-semiconductor (CMOS) single-photon avalanche diodes (SPADs) and features a fully digital readout. The dSiPM prototype was…