Related papers: Combining one and two photon polymerization for ac…
Meeting the escalating demands of data transmission and computing, driven by artificial intelligence (AI), requires not only faster optical transceivers but also advanced integration technologies that can seamlessly combine photonic and…
3D printing allows rapid fabrication of complex objects from digital designs. One 3D-printing process, direct laser writing, polymerises a light-sensitive material by steering a focused laser beam through the shape of the object to be…
Efficiently coupling light from optical fibers into photonic integrated circuits is a key step toward practical photonic devices. While a notable coupling can be achieved by out of plane couplers such as grating couplers, their basic planar…
Photonic Integrated Circuits (PICs) offer transformative potential for computing systems, enabling high-bandwidth neuromorphic processors and facilitating low decoherence quantum computing on a chip scale platform. However, the development…
Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed elements allow for efficient coupling of light to etched facets of nanophotonic…
Multi-photon lithography has emerged as a powerful tool for photonic integration, allowing to complement planar photonic circuits by 3D-printed freeform structures such as waveguides or micro-optical elements. These structures can be…
Two-dimensional (2-D) materials are of tremendous interest to integrated photonics given their singular optical characteristics spanning light emission, modulation, saturable absorption, and nonlinear optics. To harness their optical…
We report the fabrication of the first 24-mode universal photonic processor (UPP) realized through femtosecond laser writing (FLW), marking the most complex UPP demonstrated to date. Optimized for quantum dot emission at 925 nm, the device…
We propose and experimentally demonstrate a photonic routing architecture that can efficiently utilize the space of multi-plane (3D) photonic integration. A wafer with three planes of amorphous silicon waveguides was fabricated and…
The rapid growth of artificial intelligence, coupled with the slowing of Moore's law, is straining computing infrastructure, as CMOS electronics face inherent limits in bandwidth, energy efficiency, and parallelism. Integrated photonic…
Photonic integration has witnessed tremendous progress over the last years, and chip-scale transceiver systems with Terabit/s data rates have come into reach. However, as on-chip integration density increases, efficient off-chip interfaces…
We propose a practical and efficient solution for the coupling of light from integrated single-mode waveguides to supercollimating planar photonic crystals on conventional silicon-on-insulator platforms. The device consists of a rib…
Light-matter interactions in the deep ultraviolet (DUV) wavelength region exhibits a variety of optical effects such as luminescence, photoisomerization, and polymerization in many materials. Despite the rich photochemistry and high spatial…
Additive manufacturing using light is commonly constrained by serial voxel-by-voxel or layer-by-layer processing, which fundamentally limits fabrication speed and scalability. Here, we introduce a single-exposure holographic…
Photonic waveguides are prime candidates for integrated and parallel photonic interconnects. Such interconnects correspond to large-scale vector matrix products, which are at the heart of neural network computation. However, parallel…
Photonic integration on plastic substrates enables emerging applications ranging from flexible interconnects to conformal sensors on biological tissues. Such devices are traditionally fabricated using pattern transfer, which is complicated…
Hybrid photonic integration exploits complementary strengths of different material platforms, thereby offering superior performance and design flexibility in comparison to monolithic approaches. This applies in particular to multi-chip…
Throughput and resolution are both of critical importance for modern manufacturing, however, they are usually contradictory with each other. Here, a high-throughput high-resolution three dimensional (3D) printing is demonstrated by…
We demonstrate the fabrication of volume holograms using 2-photon polymerization with dynamic control of light exposure. We refer to our method as (3+1)D printing. Volume holograms that are recorded by interfering reference and signal beams…
We report on the fabrication of two-dimensional periodic photonic nanostructures by nanoimprint lithography and dry etching, and their integration into a 1-{\mu}m-thin mono-crystalline silicon solar cell. Thanks to the periodic…