Related papers: A Simple Numerical Method for Evaluating Heat Diss…
1,2-Ethanediol, 1,2-propanediol and their aqueous solutions are widely used as heat transfer fluids. Their thermal conductivity is a vital physical property, yet there are only few reports in literature. In this paper, thermal conductivity…
Estimation of thermal contact resistances between cylinders can be achieved using heating on the cross sections by a laser spot and measurement of the temperature response by IR thermography. This type of measurement makes it possible to…
We compute atomistically the heat conductance for ultra-thin pristine silicon nanowires (SiNWs) with diameters ranging from 1 to 5 nm. The room temperature thermal conductance is found to be highly anisotropic: wires oriented along the…
Laser-cooled neutral atoms from a low-velocity atomic source are guided via a magnetic field generated between two parallel wires on a glass substrate. The atoms bend around three curves, each with a 15-cm radius of curvature, while…
A good understanding of the heat transfer in fused filament fabrication is crucial for an accurate stress prediction and subsequently for repetitive, high quality printing. This work focuses on two challenges that have been presented when…
The transfer matrix formalism is widely used in modeling heat diffusion in layered structures.Due to an intrinsic numerical instability issue, which has not yet drawn enough attention to the heat transfer community,this formalism fails at…
Thermal rectification which is a diode-like behavior of heat flux has been studied over a long time. However, a universal and systematic physical description is still lacking. In this letter, a perturbation theory of thermal rectification…
Particle beds are widely used in various systems and processes, such as particle heat exchangers, granular flow reactors, and additive manufacturing. Accurate modeling of thermal conductivity of particle beds and understanding of their heat…
Non-Fourier heat conduction models assume wave-like behavior does exist in the heat conduction process. Based on this wave-like behavior, thermal conduction controlled in a one-dimensional periodical structure, named thermal wave crystal,…
Temperature rise of qubits due to heating is a critical issue in large-scale quantum computers based on quantum-dot (QD) arrays. This leads to shorter coherence times, induced readout errors, and increased charge noise. Here, we propose a…
We present a first-principles study of a coherent relationship between the optimized geometry and conductance of a three-aluminum-atom wire during its elongation process. Our simulation employs the most definite model including…
In the production of tapered optical fibers, it is important to control the fiber shape according to application-dependent requirements and to ensure adiabatic tapers. Especially in the transition regions, the fiber shape depends on the…
A 3D thermoelectric numerical model is used to investigate different internal heat loss mechanisms for a thermoelectric generator with bismuth telluride p- and n-legs. The model considers all thermoelectric effects, temperature dependent…
We study the thermal breakage of a discrete one-dimensional string, with open and fixed ends, in the heavily damped regime. Basing our analysis on the multidimensional Kramers escape theory, we are able to make analytical predictions on the…
We propose a methodology to perform a self-consistent analysis of the physical properties of the emitting gas of HII galaxies adequate to the data that can be obtained with the XXI century technology. This methodology requires the…
Additive manufacturing and welding processes are highly sensitive to heat dissipation, where improper thermal management leads to residual stresses, distortions, and cracking. Existing heat transfer models, such as Rosenthal's solutions,…
We have studied thermal gradients in thin Cu and AlMn wires, both experimentally and theoretically. In the experiments, the wires were Joule heated non-uniformly at sub-Kelvin temperatures, and the resulting temperature gradients were…
The insufficient stability and reliability of Optical Voltage Sensor is primarily caused by thermal stress induced birefringence. In this paper, a method based on arbitrary electric field direction modulation and isomerism electrodes is…
10 H SiC thin films are potential candidates for devices that can be used in high temperature and high radiation environment. Measurement of thermal conductivity of thin films by a non-invasive method is very useful for such device…
An innovative and accurate dynamic Compact Thermal Model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily…