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We present the design and characterization of the first full chain precision timing prototype ASIC, named ETL Readout Chip version 1 (ETROC1) for the CMS MTD endcap timing layer (ETL) upgrade. The ETL utilizes Low Gain Avalanche Diode…
A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to…
We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\mu$m thick, produced at VTT…
The ATLASpix high-voltage monolithic active pixel sensor (HV-MAPS) was designed as a technology demonstrator for the ATLAS ITk Upgrade and the CLIC tracking detector. In this contribution new results from laboratory-based energy calibration…
During LHC Long Shutdown 3, the ALICE experiment will replace the three innermost layers of its Inner Tracking System (ITS2) with a new vertex detector, the ITS3. This new detector will be assembled using wafer-scale, stitched Monolithic…
The ALICE ITS3 is a novel vertex detector replacing the innermost layers of ITS2 during LS3. Composed of three truly cylindrical layers of wafer-sized 65 nm stitched Monolithic Active Pixel Sensors, ITS3 provides high-resolution tracking of…
Ensuring end-to-end security in image sensors has become essential as visual data can be exposed through multiple stages of the imaging pipeline. Advanced protection requires encryption to occur before pixel values appear on any readout…
The MuPix7 is a prototype high voltage monolithic active pixel sensor with 103 times 80 um2 pixels thinned to 64 um and incorporating the complete read-out circuitry including a 1.25 Gbit/s differential data link. Using data taken at the…
We report the demonstration of a low-power pixelated readout system designed for three-dimensional ionization charge detection and digital readout of liquid argon time projection chambers (LArTPCs). Unambiguous 3D charge readout was…
Detectors at future high energy colliders will face enormous technical challenges. Disentangling the unprecedented numbers of particles expected in each event will require highly granular silicon pixel detectors with billions of readout…
Pixel Detectors, as the current technology of choice for the innermost vertex detection, have reached a stage at which large detectors have been built for the LHC experiments and a new era of developments, both for hybrid and for monolithic…
During the Long Shutdown 2 of the LHC in 2018/2019, the ALICE experiment plans the installation of a novel Inner Tracking System. It will replace the current six layer detector system with a seven layer detector using Monolithic Active…
The high integration density of MAPS, with silicon sensor and readout electronics implemented in the same device, allows very thin structures with a greatly reduced material budget. Thicknesses of $\mathcal{O}$(50~$\mu$m), values at which…
We report on measurements of 1 and 1.5 MeV monoenergetic electrons with a Timepix3-based detector using a 0.5 mm thick silicon sensor. A $^{90}$Sr $\beta$-emitting radioisotope was used as the source of electrons, and a monochromator…
Many years of research and development of High Voltage Monolithic Active Pixel Sensors (HVMAPS) have culminated in the final design for the Mu3e pixel sensor. MuPix10 is a fully monolithic sensor with an active pixel matrix size of…
The CERN-RD50 CMOS working group develops the RD50-MPWseries of monolithic high-voltage CMOS pixel sensors for potential use in future high luminosity experiments such as the HL-LHC and FCC-hh. In this contribution, the design of the latest…
Direct electron detection is currently revolutionizing many fields of electron microscopy due to its lower noise, its reduced point-spread function, and its increased quantum efficiency. More specifically to this work, Timepix3 is a…
To detect tracks of charged particles close to the interaction point in high energy physics experiments of the next generation colliders, hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the present…
The proposed Electron-Ion Collider (EIC) will utilize high-luminosity high-energy electron+proton ($e+p$) and electron+nucleus ($e+A$) collisions to solve several fundamental questions including searching for gluon saturation and studying…
Following in the footsteps of the LHC, the Future Circular Collider (FCC) plans to be the next multi-generational collider project. In the first stage, FCC-ee will collide intense beams of electrons and positrons at centre of mass energies…