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We consider the issue of calibration in large language models (LLM). Recent studies have found that common interventions such as instruction tuning often result in poorly calibrated LLMs. Although calibration is well-explored in traditional…

Machine Learning · Computer Science 2024-06-28 Maohao Shen , Subhro Das , Kristjan Greenewald , Prasanna Sattigeri , Gregory Wornell , Soumya Ghosh

This paper reports on the methods and results of a theoretical analysis to design an insulator which must provide a thermally quiet environment to test on ground delicate temperature sensors and associated electronics. These will fly on…

General Relativity and Quantum Cosmology · Physics 2007-05-23 Alberto Lobo , Miquel Nofrarias , Juan Ramos-Castro , Josep Sanjuan

Internal short circuits are a leading cause of battery thermal runaway, and hence a major safety issue for electric vehicles. An internal short circuit with low resistance is called a hard internal short, which causes a high internal…

Systems and Control · Electrical Eng. & Systems 2020-10-27 Ting Cai , Peyman Mohtat , Anna G. Stefanopoulou , Jason B. Siegel

The temperature parameter plays a profound role during training and/or inference with large foundation models (LFMs) such as large language models (LLMs) and CLIP models. Particularly, it adjusts the logits in the softmax function in LLMs,…

Machine Learning · Computer Science 2024-06-18 Zi-Hao Qiu , Siqi Guo , Mao Xu , Tuo Zhao , Lijun Zhang , Tianbao Yang

Accurate thermal modeling of Terminal Test Masses (TTMs) is crucial for optimizing the sensitivity of gravitational wave interferometers like Virgo. In fact, in such gravitational wave detectors even minimal laser power absorption can…

The reliability of bump connection structures has become a critical aspect of future silicon detectors for particle physics. The High Granularity Timing Detector (HGTD) for the ATLAS experiment at the High-Luminosity Large Hadron Collider…

Instrumentation and Detectors · Physics 2025-09-18 Y. Li , A. Aboulhorma , M. Ait Tamlihat , H. M. Alfanda , N. Atanov , O. Atanova , I. Azzouzi , J. Barreiro Guimarães Da Costa , T. Beau , D. Benchekroun , F. Bendebba , Y. Bimgdi , A. Blot , A. Boikov , J. Bonis , D. Boumediene , C. Brito , A. S. Brogna , A. M. Burger , L. Cadamuro , Y. Cai , N. Cartalade , R. Casanova Mohr , Y. Che , X. Chen , R. Cherkaoui El Moursli , E. Y. S. Chow , L. D. Corpe , C. G. Crozatier , L. D'Eramo , S. Dahbi , D. Dannheim , G. Daubard , Y. I. Davydov , C. de La Taille , J. Debevc , Y. Degerli , E. Delagnes , F. Deliot , M. Dhellot , G. Di Gregorio , P. Dinaucourt , P. J. Dos Santos De Assis , C. Duan , O. Duarte , F. Dulucq , J. Ehrecke , Y. El Ghazali , A. El Moussaouy , R. Estevam , A. Falou , L. Fan , Z. Fan , Y. Fan , K. Farman , F. Fassi , Y. Feng , M. Ferreira , F. Filthaut , F. Fischer , J. Fu , P. Fusté , G. Gaspar De Andrade , Z. Ge , R. Gonçalo , M. Gouighri , S. Grinstein , K. Gritsay , F. Guilloux , S. Guindon , A. Haddad , S. E. D. Hammoud , L. Han , A. M. Henriques Correia , M. Hidaoui , B. Hiti , J. Hofner , S. Hou , P. J. Hsu , K. Hu , Y. Huang , X. Huang , C. Insa , J. Jeglot , X. Jia , G. Kramberger , M. Kuriyama , B. Y. Ky , D. Lacour , A. Lafarge , B. Lakssir , A. Lantheaume , D. Laporte , A. Leopold , M. Li , S. Li , L. Li , S. Li , H. Li , Z. Li , Z. Liang , S. Liang , M. A. Lisboa Leite , B. Liu , Y. L. Liu , K. Liu , K. Liu , Y. W. Liu , M. Lu , Y. J. Lu , F. L. Lucio Alves , F. Lyu , X. Ma , K. Ma , D. Macina , R. Madar , N. Makovec , S. Malyukov , I. Mandić , T. Manoussos , S. Manzoni , G. Martin-Chassard , F. Martins , L. Masetti , R. Mazini , E. Mazzeo , R. Menegasso , J. -P. Meyer , Y. Miao , A. Migayron , M. Mihovilovic , M. Milovanovic , M. Missio , V. Moskalenko , N. Mouadili , A. Moussa , I. Nikolic-Audit , C. C. Ohm , H. Okawa , S. Okkerman , M. Ouchrif , C. Pénélaud , A. Parreira , B. Pascual Dias , J. Pinol Bel , P. -O. Puhl , M. Puklavec , M. Qi , J. Qin , H. Ren , H. Riani , S. Ridaouni , V. Rogozin , L. Royer , F. Rudnyckyj , E. F. Saad , G. T. Saito , A. Salem , H. Santos , Ph. Schwemling , N. Seguin-Moreau , L. Serin , R. P. Serrano Fernandez , Q. Sha , A. Shaikovskii , L. Shan , R. Shen , X. Shi , P. Skomina , H. Smitmanns , H. L. Snoek , A. P. Soulier , A. Stein , H. Stenzel , J. Strandberg , W. Sun , X. Sun , Y. Sun , Y. Tan , K. Tariq , Y. Tayalati , S. Terzo , A. Torrento Coello , S. Trincaz-Duvoid , U. M. Vande Voorde , I. Velkovska , R. P. Vieira , L. A. Vieira Lopes , A. Visibile , J. Wan , W. Wang , C. Wang , Y. Wang , Y. Wang , A. Wang , T. Wang , T. Wang , S. M. Wang , Q. Weitzel , J. Wu , W. Wu , Y. Wu , M. Wu , L. Xia , H. Xu , D. Xu , L. Xu , Z. Yan , X. Yang , X. Yang , H. Yang , H. Yang , J. Ye , I. Youbi , J. Yuan , I. Zahir , H. Zeng , T. Zhang , J. Zhang , Z. Zhang , L. Zhang , D. Zhang , M. Zhao , Z. Zhao , X. Zheng , Z. Zhou , Y. Zhu , X. Zhuang

Measuring thermodynamic quantities can be easy or not, depending on the system that is being studied. For a macroscopic object, measuring temperatures can be as simple as measuring how much a column of mercury rises when in contact with the…

Quantum Physics · Physics 2015-09-15 O. P. de Sá Neto , M. C. de Oliveira , G. J. Milburn

Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…

Distributed, Parallel, and Cluster Computing · Computer Science 2021-01-01 Seyed Mehdi Hosseini Motlagh

Robust and non-destructive material classification is a challenging but crucial first-step in numerous vision applications. We propose a physics-guided material classification framework that relies on thermal properties of the object. Our…

Computer Vision and Pattern Recognition · Computer Science 2023-04-04 Aniket Dashpute , Vishwanath Saragadam , Emma Alexander , Florian Willomitzer , Aggelos Katsaggelos , Ashok Veeraraghavan , Oliver Cossairt

This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…

Materials Science · Physics 2007-09-13 Peter E. Raad , Pavel L. Komarov , M. Burzo

While previous distribution shift detection approaches can identify if a shift has occurred, these approaches cannot localize which specific features have caused a distribution shift -- a critical step in diagnosing or fixing any underlying…

Machine Learning · Computer Science 2021-07-16 Sean Kulinski , Saurabh Bagchi , David I. Inouye

Despite decades of efforts using thermography to detect delamination in concrete decks, challenges still exist in removing environmental noise from thermal images. The performance of conventional temperature-contrast approaches can be…

Image and Video Processing · Electrical Eng. & Systems 2019-06-11 Chongsheng Cheng , Ri Na , Zhigang Shen

In this paper we focus on analyzing the thermal modality of tactile sensing for material recognition using a large materials database. Many factors affect thermal recognition performance, including sensor noise, the initial temperatures of…

Robotics · Computer Science 2022-11-02 Haoping Bai , Haofeng Chen , Elizabeth Healy , Charles C. Kemp , Tapomayukh Bhattacharjee

By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…

Hardware Architecture · Computer Science 2020-03-20 Khanh N. Dang , Akram Ben Ahmed , Abderazek Ben Abdallah , Xuan-Tu Tran

This paper deals with the solution of an inverse problem for the heat equation aimed at nondestructive evaluation of fractures. A fundamental step in any typical iterative inversion method, is the numerical solution of the underlying direct…

Applied Physics · Physics 2019-05-27 G. Inglese , R. Olmi , A. Scalbi

This work presents ThermoMesh, a passive thin-film thermoelectric mesh sensor designed to detect and characterize spatio-temporally sparse heat sources through conduction-based thermal imaging. The device integrates thermoelectric junctions…

Robotics · Computer Science 2026-05-05 Sajjad Boorghan Farahan , Ahmed Alajlouni , Jingzhou Zhao

Estimation of thermal contact resistances between cylinders can be achieved using heating on the cross sections by a laser spot and measurement of the temperature response by IR thermography. This type of measurement makes it possible to…

Medical Physics · Physics 2025-11-25 Thomas Lahens , Alain Sommier , Marie-Marthe Groz , Jean-Christophe Batsale

Lattice thermal conductivity (TC) of semiconductors is crucial for various applications, ranging from microelectronics to thermoelectrics. Data-driven approach can potentially establish the critical composition-property relationship needed…

Materials Science · Physics 2022-08-30 Zeyu Liu , Meng Jiang , Tengfei Luo

Essential to various practical applications of lithium-ion batteries is the availability of accurate equivalent circuit models. This paper presents a new coupled electro-thermal model for batteries and studies how to extract it from data.…

Systems and Control · Electrical Eng. & Systems 2024-08-21 Hao Tu , Xinfan Lin , Yebin Wang , Huazhen Fang

This paper proposes a time-domain fault location identification method for mixed overhead-underground power distribution systems that can handle challenging fault scenarios such as sub-cycle faults, arcing faults and evolving faults. The…

Systems and Control · Electrical Eng. & Systems 2025-10-23 Ali Shakeri Kahnamouei , Saeed Lotfifard
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