Related papers: Mitigating the Latency-Area Tradeoffs for DRAM Des…

As the demand for high-speed and low-power electronics continues to grow, the quasi-delay-insensitive (QDI) asynchronous domain of digital design has emerged as a promising alternative to traditional clock-based designs. However, the…

In modern systems, DRAM-based main memory is significantly slower than the processor. Consequently, processors spend a long time waiting to access data from main memory, making the long main memory access latency one of the most critical…

Memory accounts for a considerable portion of the total power budget and area of digital systems. Furthermore, it is typically the performance bottleneck of the processing units. Therefore, it is critical to optimize the memory with respect…

Recent nano-technological advances enable the Monolithic 3D (M3D) integration of multiple memory and logic layers in a single chip, allowing for fine-grained connections between layers and significantly alleviating main memory bottlenecks.…

Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length through their smaller form factor. We can leverage the…

Monolithic 3D (M3D) technology enables high density integration, performance, and energy-efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting…

Over the past two decades, the storage capacity and access bandwidth of main memory have improved tremendously, by 128x and 20x, respectively. These improvements are mainly due to the continuous technology scaling of DRAM (dynamic…

DRAM is the prevalent main memory technology, but its long access latency can limit the performance of many workloads. Although prior works provide DRAM designs that reduce DRAM access latency, their reduced storage capacities hinder the…

This work presents a novel monolithic 3D (M3D) FPGA architecture that leverages stackable back-end-of-line (BEOL) transistors to implement configuration memory and pass gates, significantly improving area, latency, and power efficiency. By…

This paper summarizes the idea of Tiered-Latency DRAM (TL-DRAM), which was published in HPCA 2013, and examines the work's significance and future potential. The capacity and cost-per-bit of DRAM have historically scaled to satisfy the…

3D DRAM has emerged as a promising approach for continued density scaling, but its viability is limited by routing and hybrid bonding constraints to periphery, which may degrade sensing margin, latency, and array efficiency. With device…

Systolic arrays are popular for executing deep neural networks (DNNs) at the edge. Low latency and energy efficiency are key requirements in edge devices such as drones and autonomous vehicles. Monolithic 3D (MONO3D) is an emerging 3D…

The major challenge when designing multipliers for FPGAs is to address several trade-offs: On the one hand at the performance level and on the other hand at the resource level utilizing DSP blocks or look-up tables (LUTs). With DSPs being a…

The Last Level Cache (LLC) is the processor's critical bridge between on-chip and off-chip memory levels - optimized for high density, high bandwidth, and low operation energy. To date, high-density (HD) SRAM has been the conventional…

AI chips commonly employ SRAM memory as buffers for their reliability and speed, which contribute to high performance. However, SRAM is expensive and demands significant area and energy consumption. Previous studies have explored replacing…

As SRAM-based caches are hitting a scaling wall, manufacturers are integrating DRAM-based caches into system designs to continue increasing cache sizes. While DRAM caches can improve the performance of memory systems, existing DRAM cache…

Many convolutional neural network (CNN) accelerators face performance- and energy-efficiency challenges which are crucial for embedded implementations, due to high DRAM access latency and energy. Recently, some DRAM architectures have been…

With emerging storage-class memory (SCM) nearing commercialization, there is evidence that it will deliver the much-anticipated high density and access latencies within only a few factors of DRAM. Nevertheless, the latency-sensitive nature…

Undoubtedly faster, larger and lower power per bit, but just how do you go about interfacing a DDR3 SDRAM DIMM to an FPGA? The DDR3 standard addresses the faster, more bandwidth and lower power per bit need, but it introduces new design…

Monolithic 3D stackable 1T1C DRAM technology is on the rise, with initial prototypes reported by the industry. This work presents a comprehensive reliability study focusing on the intricate interplay between the row hammer effect and the…