Related papers: A universal 3D imaging sensor on a silicon photoni…
Visible and near-infrared spectrum photonic integrated circuits are quickly becoming a key technology to address the scaling challenges in quantum information and biosensing. Thus far, integrated photonic platforms in this spectral range…
Traditional photonic integrated circuit (PIC) inherits the mature CMOS fabrication process from the electronic integrated circuit (IC) industry. However, this process also limits the PIC structure to a single-waveguide-layer configuration.…
Conventional semiconductors such as silicon and InGaAs based photodetectors have encountered a bottleneck in modern electronics and photonics in terms of spectral coverage, low resolution, non-transparency, non-flexibility and…
The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close to the beamline (2-3 mm). This implies the need of slim edges of about 100-200 $\mu$m width for…
Silicon photonics (SiP) integrated coherent image sensors offer higher sensitivity and improved range-resolution-product compared to direct detection image sensors such as CCD and CMOS devices. Previous generation of SiP coherent imagers…
Advanced artificial intelligence and machine learning have great potential to redefine how skin lesions are detected, mapped, tracked and documented. Here, We propose a 3D whole-body imaging system known as 3DSkin-mapper to enable automated…
Ultra-wideband 3D imaging spectrometry in the millimeter-submillimeter (mm-submm) band is an essential tool for uncovering the dust-enshrouded portion of the cosmic history of star formation and galaxy evolution. However, it is challenging…
Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk…
Measurements of microscale surface patterns are essential for process and quality control in industries across semiconductors, micro-machining, and biomedicines. However, the development of miniaturized and intelligent profiling systems…
Lensless imaging is an important and challenging problem. One notable solution to lensless imaging is a single pixel camera which benefits from ideas central to compressive sampling. However, traditional single pixel cameras require many…
Perception in 3D has become standard practice for a large part of robotics applications. High quality 3D perception is costly. Our previous work on a nodding 2D Lidar provides high quality 3D depth information with low cost, but the sparse…
While photonic integrated circuits (PICs) are being widely used in applications such as telecommunications and datacenter interconnects, PICs capable of replacing bulk optics and fibers in high-precision, highly-coherent applications will…
Flying Triangulation sensors enable a free-hand and motion-robust 3D data acquisition of complex shaped objects. The measurement principle is based on a multi-line light-sectioning approach and uses sophisticated algorithms for real-time…
Nonlinear optical processing of ambient natural light is highly desired in computational imaging and sensing applications. A strong optical nonlinear response that can work under weak broadband incoherent light is essential for this…
In this paper, we propose a novel 3D object detector that can exploit both LIDAR as well as cameras to perform very accurate localization. Towards this goal, we design an end-to-end learnable architecture that exploits continuous…
Complex-field imaging is indispensable for numerous applications at wavelengths from X-ray to THz, with amplitude describing transmittance (or reflectivity) and phase revealing intrinsic structure of the target object. Coherent diffraction…
Structure from Motion (SfM) often fails to estimate accurate poses in environments that lack suitable visual features. In such cases, the quality of the final 3D mesh, which is contingent on the accuracy of those estimates, is reduced. One…
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled…
Photonic integration on plastic substrates enables emerging applications ranging from flexible interconnects to conformal sensors on biological tissues. Such devices are traditionally fabricated using pattern transfer, which is complicated…
Extending two-dimensional photonic integrated circuits (PICs) to three-dimensional (3D) configurations promises great potential for scaling up integration, enhancing functionality, and improving performance of PICs. Silicon-based 3D PICs…