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Monolithic three-dimensional integration of memory and logic circuits could dramatically improve performance and energy efficiency of computing systems. Some conventional and emerging memories are suitable for vertical integration,…
In this article we propose two novel 3D finite element models, denoted method A and B, for electron and hole Drift-Diffusion (DD) current densities. Method A is based on a primal-mixed formulation of the DD model as a function of the…
3D print is a recently developed technique, for single-unit production, and for structures that have been impossible to build previously. The current work presents a method to 3D print polymer bonded isotropic hard magnets with a low-cost,…
As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity. Precise control of the spacing between these chips is…
Three-dimensional (3D) nanomagnetic devices such as the vertical racetrack memory have attracted a huge interest due to their potential for memory and logic applications. However, their implementation has not been realised due to great…
Producing interactive 3D printed objects currently requires laborious 3D design and post-instrumentation with off-the-shelf electronics. Multi-material 3D printing using conductive PLA presents opportunities to mitigate these challenges. We…
Accurate and efficient thermal simulations of induction machines are indispensable for detecting thermal hot spots and hence avoiding potential material failure in an early design stage. A goal is the better utilization of the machines with…
This work deals with the modelling and simulation of curing phenomena in adhesively bonded piezo metal composites which consist of an adhesive layer with integrated piezoelectric module and two surrounding metal sheet layers. In a first…
Single- and multi-band Hubbard models have been found to describe many of the complex phenomena that are observed in the cuprate and iron-based high-temperature superconductors. Simulations of these models therefore provide an ideal…
On-silicon inductors using a bulk 0.18 {\mu}m CMOS process have been designed. By shunting different metal layers in parallel, inductor values and quality factors were simulated. Selected inductors were then employed in two open-loop buck…
The Conductor on Rounded Core (CORC) cables manufactured by Advanced Conductor Technologies with current densities beyond 300 Amm^-2 at 4.2 K, and bending diameter of up to 3.5 cm, are considered as one of the strongest candidates for the…
Data are presented on inductance of various features used in superconductor digital integrated circuits such as microstrip and stripline inductors with linewidths down to 120 nm and different combinations of ground plane layers, effect of…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
Additive manufacturing of polymer bonded magnets is a recently developed technique, for single-unit production, and for structures that have been impossible to manufacture previously. Also new possibilities to create a specific stray field…
A stochastic 3D modeling approach for the nanoporous binder-conductive additive phase in hierarchically structured cathodes of lithium-ion batteries is presented. The binder-conductive additive phase of these electrodes consists of carbon…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
Quadcopters are increasingly used for applications ranging from hobby to industrial products and services. This paper serves as a tutorial on the design, simulation, implementation, and experimental outdoor testing of digital quadcopter…
Consumer-level multi-material 3D printing with conductive thermoplastics enables fabrication of interactive elements for bespoke tangible devices. However, large feature sizes, high resistance materials, and limitations of printable control…
In this review we introduce computer modelling and simulation techniques which are used for ferrimagnetic materials. We focus on models where thermal effects are accounted for, atomistic spin dynamics and finite temperature macrospin…
We present a design of a bird-inspired morphing wing aircraft, including bionic research, modeling, simulation and flight experiments. Inspired by birds and activated by a planar linkage, our proposed aircraft has three key states: gliding,…