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Related papers: Electromigration Response of Microjoints in 3DIC P…

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In this work, we integrate different computational tools based on multi-phase-field simulations to account for the evolution of morphologies and crystallographic defects of Cu/Sn/Cu sandwich interconnect structures that are widely used in…

Materials Science · Physics 2018-10-24 Vahid Attari , Supriyo Ghosh , Thien Duong , Raymundo Arroyave

The electro–mechanical connection between under bump metallization (UBM) and solder in flip–chip bonding is achieved by the formation of brittle intermetallic compounds (IMCs) during the soldering process. These IMCs continue to grow in…

Applied Physics · Physics 2018-07-23 Varun A Baheti

Two-dimensional (2D) materials provide unique opportunities to realize emergent phenomena by reducing dimensionality. Using scanning tunneling microscopy combined with first-principles calculations, we determine an intriguing case of a…

Materials Science · Physics 2025-12-30 Wanru Ma , Ye Yang , Zuowei Liang , Ping Wu , Fanbao Meng , Zhenyu Wang , Xianhui Chen

Dielectric microstructures have been reported to have negative influences on perm-selective ion transportation because ions do not migrate in areas where the structures are located. However, the structure can promote the transportation if…

Applied Physics · Physics 2019-11-05 Keon Huh , So-Yoon Yang , Jae Suk Park , Jung A Lee , Hyomin Lee , Sung Jae Kim

Recent progress in colloidal science has led to elaborate self-assembled structures whose complexity raises hopes for elaborating new materials. However, the throughputs are extremely low and consequently, the chance to produce materials of…

Soft Condensed Matter · Physics 2014-09-16 Bingqing Shen , Joshua Ricouvier , Mathilde Reyssat , Florent Malloggi , Patrick Tabeling

Field induced assembly of reconfigurable structures with complex hierarchical configurations has recently become an area of intense research with the promise for exciting applications in programmable self-assembly and nano/microstructure…

Soft Condensed Matter · Physics 2026-01-14 Indira Barros , Sayanth Ramachandran , Indrani Chakraborty

Metallic oxide SrVO3 represents a prototype system for the study of the mechanism behind thickness-induced metal-to-insulator transition (MIT) or crossover in thin films due to its simple cubic symmetry with one electron in the 3d state in…

Strongly Correlated Electrons · Physics 2019-10-16 Gaomin Wang , Zhen Wang , Meng Meng , Mohammad Saghayezhian , Lina Chen , Chen Chen , Hangwen Guo , Yimei Zhu , Ward Plummer , Jiandi Zhang

Laser-based additive manufacturing offers a promising route for 3D printing of metallic parts. We evidence experimentally a particular columnar solidification microstructure in a Laser Powder-Bed Fusion processed Inconel 718 nickel-based…

Materials Science · Physics 2019-01-23 G. Boussinot , M. Apel , J. Zielinski , U. Hecht , J. H. Schleifenbaum

We explore the effect of faceting on possible mechanisms for mass transport around electromigration voids in aluminum interconnects. Motivated by linear response estimates which suggest that particle flux would be much higher along steps…

mtrl-th · Physics 2008-02-03 L. K. Wickham , James P. Sethna

Interfacial hydration structures are crucial in wide-ranging applications, including battery, colloid, lubrication etc. Multivalent ions like Mg2+ and La3+ show irreplaceable roles in these applications, which are hypothesized due to their…

Chemical Physics · Physics 2024-06-28 Han Li , Zhi Xu , Jiacheng Li , Alessandro Siria , Ming Ma

Recently it was suggested that transient excitonic instability can be realized in optically-pumped two-dimensional (2D) Dirac materials (DMs), such as graphene and topological insulator surface states. Here we discuss the possibility of…

Materials Science · Physics 2018-02-14 Anna Pertsova , Alexander V. Balatsky

The two-dimensional electron gas at the LaTiO3/SrTiO3 or LaAlO3/SrTiO3 oxide interfaces becomes superconducting when the carrier density is tuned by gating. The measured resistance and superfluid density reveal an inhomogeneous…

Composite materials are used across engineering applications for their superior mechanical performance, a result of efficient load transfer between the structure and matrix phases. However, the inherently two-dimensional structure of…

Soft Condensed Matter · Physics 2026-04-21 Andrew Y. Chen , Carlos M. Portela

The diffusion of intrinsic defects in 3C-SiC is studied using an ab initio method based on density functional theory. The vacancies are shown to migrate on their own sublattice. The carbon split-interstitials and the two relevant silicon…

Materials Science · Physics 2009-11-10 Michel Bockstedte , Alexander Mattausch , Oleg Pankratov

Fine manipulation of fluid flows at the microscale has a tremendous impact on mass transport phenomena of chemical and biological processes inside microfluidic platforms. Fluid mixing in the laminar flow regime at low Reynolds is poorly…

The performance of nanoscale electronic devices based on a two-three dimensional (2D-3D) interface is significantly affected by the electrical contacts that interconnect these materials with external circuitry. This work investigates charge…

Emergent magnetic states at oxide interfaces arise from the interplay of charge transfer, orbital reconstruction, and dimensional confinement, offering a route to engineered correlated-electron behavior in nanoscale spintronic materials.…

Transitions between solid-like and fluid-like states in living tissues have been found in steps of embryonic development and in stages of disease progression. Our current understanding of these transitions has been guided by experimental…

Soft Condensed Matter · Physics 2024-11-20 Steven J. Chisolm , Emily Guo , Vignesh Subramaniam , Kyle D. Schulze , Thomas E. Angelini

Freestanding silicene, a monolayer of Si arranged in a honeycomb structure, has been predicted to give rise to massless Dirac fermions, akin to graphene. However, Si structures grown on a supporting substrate can show properties that…

Mesoscale and Nanoscale Physics · Physics 2015-05-25 Jiagui Feng , Sean Wagner , Pengpeng Zhang

Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…

Hardware Architecture · Computer Science 2025-08-20 Yongxiang Liu , Yuchun Ma , Eren Kurshan , Glenn Reinman , Jason Cong
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