Related papers: Time Resolution Studies with Timepix3 Assemblies w…

Direct electron detection is currently revolutionizing many fields of electron microscopy due to its lower noise, its reduced point-spread function, and its increased quantum efficiency. More specifically to this work, Timepix3 is a…

Test beam measurements have been carried out with a 3D sensor on a Timepix3 ASIC and the time measurements are presented. The measurements are compared to those of a thin planar sensor on Timepix3. It is shown that for a perpendicularly…

For the advancement of the understanding of timing systematics in pixelized readout chips and for the benefit of future fast timing detectors to aid 4D tracking technology in the HL-LHC, we have performed detailed studies of the timing…

The timing performance of silicon sensors bump-bonded to Timepix3 ASICs is investigated, prior to and after different types of irradiation up to $8 \times 10^{15} 1 \mathrm{\,Me\kern -0.1em V} \mathrm{ \,n_{eq}} {\mathrm{ \,cm}}^{-2}$. The…

The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;\mu\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole…

Hybrid pixel detectors have a well-established array of applications ranging from particle physics to life sciences. The small dimensions of Timepix3 as well as its relatively low energetic expenses make it an intriguing option additionally…

This study investigates the response of Timepix3 semiconductor pixel detectors in proton beams of varying intensities, with a focus on FLASH proton therapy. Using the Timepix3 ASIC chip, we measured the spatial and spectral characteristics…

The event-driven hybrid-pixel detector readout chip, Timepix3, has the ability to simultaneously measure the time of an event on the nanosecond timescale and the energy deposited in the sensor. However, the behaviour of the system when two…

Timepix and Timepix3 are hybrid pixel detectors ($256\times 256$ pixels), capable of tracking ionizing particles as isolated clusters of pixels. To efficiently analyze such clusters at potentially high rates, we introduce multiple…

The hybrid architecture of the Timepix (TPX) family of detectors enables the use of different semiconductor sensors, most commonly silicon (Si), as well as high-density materials such as Cadmium Telluride (CdTe) or Gallium Arsenide (GaAs).…

This paper describes an iterative method of per-pixel energy calibration of hybrid pixel detectors with GaAs:Cr sensor and Timepix readout chip. A convolution of precisely measured spectra of characteristic X-rays of different metals with…

The design of a detector system comprised of four silicon sensors bump-bonded to Timepix4 ASICs is described together with its data acquisition system, operational infrastructure, and dedicated software. The spatial and temporal performance…

The spatial and temporal performance of a telescope system comprising planar silicon sensors bump-bonded to Timepix4-v2 ASICs are assessed at the CERN SPS using a $180$~GeV/$c$ mixed hadron beam. The pointing resolution at the centre of the…

The hybrid pixel detector Timepix3 allows the measurement of the time and energy deposition of an event simultaneously in each 55 $\mu$m pixel, which makes Timepix3 a promising approach for a compact Compton camera. However, the angular…

We present a novel single-photon detector based on a vacuum tube incorporating a photocathode, a microchannel plate (MCP), and a Timepix4 CMOS ASIC functioning as a pixelated anode. Designed to handle photon rates up to 1 billion per second…

In this work we have developed a prototype gaseous pixel detector by combining a micromegas grid with a Timepix3 chip for the readout. The micromegas foil supported by a matrix of pillars about 50 $\mathrm{\mu m}$ high was manually placed…

In the last years, high-resolution time tagging has emerged as the tool to tackle the problem of high-track density in the detectors of the next generation of experiments at particle colliders. Time resolutions below 50ps and event average…

This work presents the first measurements performed on the Timespot1 ASIC. As the second prototype developed for the TimeSPOT project, the ASIC features a 32x32 channels hybrid-pixel matrix. Targeted to space-time tracking applications in…

A characterisation of the Timepix4 pixel front-end with a strong focus on timing performance is presented. Externally generated test pulses were used to probe the per-pixel time-to-digital converter (TDC) and measure the time-bin sizes by…

A second monolithic silicon pixel prototype was produced for the MONOLITH project. The ASIC contains a matrix of hexagonal pixels with 100 {\mu}m pitch, readout by a low-noise and very fast SiGe HBT frontend electronics. Wafers with 50…