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With the thriving of deep learning, 3D Convolutional Neural Networks have become a popular choice in volumetric image analysis due to their impressive 3D contexts mining ability. However, the 3D convolutional kernels will introduce a…
Quantum computing has the potential to provide solutions to problems that are intractable on classical computers, but the accuracy of the current generation of quantum computers suffer from the impact of noise or errors such as leakage,…
Micro-Aerial Vehicles (MAVs) have the advantage of moving freely in 3D space. However, creating compact and sparse map representations that can be efficiently used for planning for such robots is still an open problem. In this paper, we…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
We propose a hybrid stochastic method for the tensor renormalization group (TRG) approach. TRG is known as a powerful tool to study the many-body systems and quantum field theory on the lattice. It is based on a low-rank approximation of…
Crosstalk in VLSI interconnects is a major constrain in DSM and UDSM technology. Among various strategies followed for its minimization, shield insertion between Aggressor and Victim is one of the prominent options. This paper analyzes the…
We present a method for relieving aluminum 3D transmon qubits from a silicon substrate using micromachining. Our technique is a high yield, one-step deep reactive ion etch that requires no additional fabrication processes, and results in…
Split manufacturing (SM) and layout camouflaging (LC) are two promising techniques to obscure integrated circuits (ICs) from malicious entities during and after manufacturing. While both techniques enable protecting the intellectual…
A front end ASIC has been designed to equip the {\mu}TPC prototype developed for the MIMAC project, which requires 3D reconstruction of low energy particle tracks in order to perform directional detection of galactic Dark Matter. Each ASIC…
This paper presents an I/O interface with Xtalk Minimizing Affine Signaling (XMAS), which is designed to support high-speed data transmission in die-to-die communication over silicon interposers or similar high-density interconnects…
Interconnect is one of the main performance determinant of modern integrated circuits (ICs). The new technology of vertical ICs places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to…
Most existing studies improve the efficiency of Split learning (SL) by compressing the transmitted features. However, most works focus on dimension-wise compression that transforms high-dimensional features into a low-dimensional space. In…
Various side-channel attacks (SCAs) on ICs have been successfully demonstrated and also mitigated to some degree. In the context of 3D ICs, however, prior art has mainly focused on efficient implementations of classical SCA countermeasures.…
Vertical field effect transistors (VOFETs) can offer short channel architecture which can further enhance the performance at low operating voltages which makes it more viable for organic electronics applications. VOFETs can be prepared with…
Thermal simulation plays a fundamental role in the thermal design of integrated circuits, especially 3D ICs. Current simulators require significant runtime for high-resolution simulation, and dismiss the complex nonlinear thermal effects,…
Multitenancy increases throughput and reduces costs in cloud-based quantum computing, but concurrent job execution introduces security risks through inter-circuit crosstalk. We characterize the structural predictability of these…
We consider the problem of transposing tensors of arbitrary dimension and describe TTC, an open source domain-specific parallel compiler. TTC generates optimized parallel C++/CUDA C code that achieves a significant fraction of the system's…
Row column addressed (RCA) transducers present a promising solution for ultrafast volumetric imaging with a reduced channel count and a large field of view. However, RCA-based 3D imaging is fundamentally limited by severe sidelobe artifacts…
We report high qubit coherence as well as low crosstalk and single-qubit gate errors in a superconducting circuit architecture that promises to be tileable to 2D lattices of qubits. The architecture integrates an inductively shunted cavity…
The need for a high-performance transceiver with high Signal to Noise Ratio (SNR) has driven the communication system to utilize the latest technique identified as oversampling systems. It was the most economical modulator and decimation in…