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In this paper, we present a new compact model of threshold switching devices which is suitable for efficient circuit-level simulations. First, a macro model, based on a compact transistor based circuit, was implemented in LTSPICE. Then, a…

This paper proposes the ViT Token Constraint and Multi-scale Memory bank (TCMM) method to address the patch noises and feature inconsistency in unsupervised person re-identification works. Many excellent methods use ViT features to obtain…

The performance of a device-to-device (D2D) underlay communication system is limited by the co-channel interference between cellular users (CUs) and D2D devices. To address this challenge, an intelligent reflecting surface (IRS) aided D2D…

A thin-sheet (TS) volume integral equation (VIE) formulation incorporating generalized sheet transition conditions (GSTCs) is presented for the simulation of three-dimensional (3D) bianisotropic metasurfaces. The metasurface is represented…

The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-scale VLSI systems with higher energy efficiency in data…

This paper addresses precoder design for secure multiple-input multiple-output (MIMO) integrated sensing and communications (ISAC) systems. We introduce a MIMO channel with a multiple-antenna eavesdropper and a multiple-antenna sensing…

Many vertebrate motor and sensory systems decussate, or cross the midline to the opposite side of the body. The successful crossing of millions of axons during development requires a complex of tightly controlled regulatory processes.…

As the complexity of the scan algorithm is dependent on the number of design registers, large SoC scan designs can no longer be verified in RTL simulation unless partitioned into smaller sub-blocks. This paper proposes a methodology to…

In this paper, the problem of semantic-based efficient image transmission is studied over the Internet of Vehicles (IoV). In the considered model, a vehicle shares massive amount of visual data perceived by its visual sensors to assist…

In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…

Time-distance helioseismology is the method of the study of the propagation of waves through the solar interior via the travel times of those waves. The travel times of wave packets contain information about the conditions in the interior…

The large physical size of superconducting qubits and their associated on-chip control structures presents a practical challenge towards building a large-scale quantum computer. In particular, transmons require a high-quality-factor…

Reconstructing complex structures from planar cross-sections is a challenging problem, with wide-reaching applications in medical imaging, manufacturing, and topography. Out-of-the-box point cloud reconstruction methods can often fail due…

Quantum computation promises to advance a wide range of computational tasks. However, current quantum hardware suffers from noise and is too small for error correction. Thus, accurately utilizing noisy quantum computers strongly relies on…

With the latest technology of vectoring, DSL data rates in the order of 100Mbps have become a reality that is under field deployment. The key is to cancel crosstalk from other lines, which is also known as multiuser MIMO cancellation for…

We explore inference-time scaling in text-guided 3D diffusion models to enhance generative quality without additional training. To this end, we introduce ITS3D, a framework that formulates the task as an optimization problem to identify the…

Enabling applications for solid state quantum technology will require systematically reducing noise, particularly dissipation, in these systems. Yet, when multiple decay channels are present in a system with similar weight, resolution to…

Traditionally, the output noise and power supply rejection of low-dropout regulators (LDOs) are optimized to minimize power supply fluctuations, reducing their impact on the low-frequency noise of target voltage-controlled oscillators…

3-D cross point phase change memory (PCM) is a promising emerging memory. However, dynamic performances of 3-D cross point PCM are limited and the role of bias scheme is unknown. Previous studies on bias schemes for planar memories use…

The integrated sensing and communications (ISAC) can achieve the sharing of hardware and spectrum resources, enabling efficient data transmission and environmental sensing. This fusion is particularly important for unmanned aerial vehicle…