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Application Specific Integrated Circuits (ASICs) are used in space-borne instruments for signal processing and detector readout. The electrical interface of these ASICs to frontend printed circuit boards (PCBs) is commonly accomplished with…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
Mathematically-secure cryptographic algorithms leak significant side channel information through their power supplies when implemented on a physical platform. These side channel leakages can be exploited by an attacker to extract the secret…
A Scanning Tunneling Microscope (STM) is one of the most important scanning probe tools available to study and manipulate matter at the nanoscale. In a STM, a tip is scanned on top of a surface with a separation of a few \AA. Often, the…
To realize the full potential of quantum computers, we must mitigate qubit errors by developing noise-aware algorithms, compilers, and architectures. Thus, simulating quantum programs on high-performance computing (HPC) systems with…
While recent text-to-speech (TTS) systems have made remarkable strides toward human-level quality, the performance of cross-lingual TTS lags behind that of intra-lingual TTS. This gap is mainly rooted from the speaker-language entanglement…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
With the upgrade of the RPCs [1]-[2] and the increase of its performances, the study and the optimization of the read-out panel is necessary in order to maintain the signal integrity and to reduce the intrinsic crosstalk. Through…
Vehicle-to-vehicle (V2V) communication is a crucial component of the future autonomous driving systems since it enables improved awareness of the surrounding environment, even without extensive processing of sensory information. However,…
Distributed inference of large language models (LLMs) using tensor parallelism can introduce communication overheads of $20$% even over GPUs connected via NVLink, a high-speed GPU interconnect. Several techniques have been proposed to…
Two-dimensional (2D) transition metal dichalcogenides (TMDs) are promising platforms for low dimensional superconductivity. However, in conventional intercalated systems, achieving a high superconducting transition temperature (Tc) often…
In time division duplexing (TDD) millimeter wave (mmWave) massive multiple-input multiple-output (MIMO) systems, downlink channel state information (CSI) can be obtained from uplink channel estimation thanks to channel reciprocity. However,…
Superconducting quantum circuits are a key platform for advancing quantum information processing and simulation. Scaling efforts currently encounter challenges such as Josephson-junction fabrication yield, design frequency targeting, and…
Cross-core communication is increasingly a bottleneck as the number of processing elements increase per system-on-chip. Typical hardware solutions to cross-core communication are often inflexible; while software solutions are flexible, they…
This paper introduces a novel method for transmitting video data over noisy wireless channels with high efficiency and controllability. The method derivates from model division multiple access (MDMA) to extract common semantic features from…
Transformer has emerged as a powerful deep-learning technique for two-dimensional (2D) seismic data interpolation, owing to its global modeling ability. However, its core operation introduces heavy computational burden due to the quadratic…
Fault-tolerant quantum computers promise the simulation of complex quantum systems beyond the reach of classical computation. In contrast, current noisy intermediate-scale quantum (NISQ) devices are constrained by hardware noise.…
Cross-component linear model (CCLM) prediction has been repeatedly proven to be effective in reducing the inter-channel redundancies in video compression. Essentially speaking, the linear model is identically trained by employing accessible…
The CMOS integrated chips at advanced technology nodes are becoming more vulnerable to various sources of faults like manufacturing imprecisions, variations, aging, etc. Additionally, the intentional fault attacks (e.g., high power…