Related papers: 3DCAM: A Low Overhead Crosstalk Avoidance Mechanis…

Application Specific Integrated Circuits (ASICs) are commonly used to efficiently process the signals from sensors and detectors in space. Wire bonding is a space qualified technique of making interconnections between ASICs and their…

Increasing circuit complexity within quantum systems based on superconducting qubits necessitates high connectivity while retaining qubit coherence. Classical micro-electronic systems have addressed interconnect density challenges by using…

Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer…

Transistor-level simulation plays a vital role in validating the physical correctness of integrated circuits. However, such simulations are computationally expensive. This paper proposes three novel reduction methods specifically tailored…

In this paper, we propose a new wireless video communication scheme to achieve high-efficiency video transmission over noisy channels. It exploits the idea of model division multiple access (MDMA) and extracts common semantic features…

This work explores and evaluates noise and crosstalk in neutral atom quantum computers. Neutral atom quantum computers are a promising platform for analog Hamiltonian simulations, which rely on a sequence of time-dependent Hamiltonians to…

Reduction in power consumption has become a major criterion of design in modern ICs. One such scheme to reduce power consumption by an IC is the use of multiple power supplies for critical and non-critical paths. To maintain the impedance…

We present the 3D Trajectory-based Stress Visualizer (3D-TSV), a visual analysis tool for the exploration of the principal stress directions in 3D solids under load. 3D-TSV provides a modular and generic implementation of key algorithms…

Heterogeneous manycore architectures are the key to efficiently execute compute- and data-intensive applications. Through silicon via (TSV)-based 3D manycore system is a promising solution in this direction as it enables integration of…

We address the challenge of crosstalk in quantum multiplexing -an obstacle to scaling throughput in quantum communication networks. Crosstalk arises when physically coupled quantum modes interfere, degrading signal fidelity. We propose a…

Near-term quantum systems tend to be noisy. Crosstalk noise has been recognized as one of several major types of noises in superconducting Noisy Intermediate-Scale Quantum (NISQ) devices. Crosstalk arises from the concurrent execution of…

Cross-modal retrieval maps data under different modality via semantic relevance. Existing approaches implicitly assume that data pairs are well-aligned and ignore the widely existing annotation noise, i.e., noisy correspondence (NC).…

By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…

3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…

In this study, we report the first Cu-filled through silicon via (TSV) integrated ion trap. TSVs are placed directly underneath electrodes as vertical interconnections between ion trap and a glass interposer, facilitating the arbitrary…

Dynamic time-division duplex (D-TDD) aided mobile communication systems bear the potential to achieve significantly higher spectral efficiency than traditional static TDD based systems. However, strong cross-link interference (CLI) may be…

We propose superconducting-semiconducting (super-semi) qubit and coupler designs based on high-quality, compact through-silicon vias (TSVs). An interposer "probe" wafer containing TSVs is used to contact a sample wafer with, for example, a…

This work proposes a 3D Stack In-Sensor-Computing (3DS-ISC) architecture for efficient event-based vision processing. A real-time normalization method using an exponential decay function is introduced to construct the time-surface, reducing…

Overlapped time domain multiplexing (OvTDM) is a novel technique for utilizing inter-symbol interference (ISI) to benefit a communication system. We implement the OvTDM technique based on turbo structure and associate a turbo product code…

3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Bandwidth Memory (HBM). However, the copper-based electrical…