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The future success of integrated circuits (IC) technology relies on the continuing miniaturization of the feature size, allowing more components per chip and higher speed. Extreme anisotropy opens new opportunities for spatial pattern…
GISAXS is often used as a versatile tool for the contactless and destruction-free investigation of nanostructured surfaces. However, due to the shallow incidence angles, the footprint of the X-ray beam is significantly elongated, limiting…
We have studied the optical properties of gratings micro-fabricated into semiconductor wafers, which can be used for simplifying cold-atom experiments. The study entailed characterisation of diffraction efficiency as a function of coating,…
Terahertz (THz) imaging has the ability to see through otherwise opaque materials. However, due to the long wavelengths of THz radiation ({\lambda}=300{\mu}m at 1THz), far-field THz imaging techniques are heavily outperformed by optical…
We report on the realization of silicon nitride membranes with enhanced and electrically tunable reflectivity. A subwavelength one-dimensional grating is directly patterned on a suspended 200 nm-thick, high stress commercial film using…
Higher resolution demands for semiconductor lithography may be fulfilled by higher numerical aperture (NA) systems. However, NAs more than the photoresist refractive index (~1.7) cause surface confinement of the image. In this letter we…
A novel fabrication method for soft x-ray transmission grating and other optical elements is presented. The method uses Focused-Ion-Beam (FIB) technology to fabricate high-quality free standing grating bars on Transmission Electron…
Atomic layer deposition (ALD) enables the conformal coating of porous materials, making the technique suitable for pore size tuning at the atomic level, e.g., for applications in catalysis, gas separation and sensing. It is, however, not…
We present measurements of the resolving power of a soft x-ray spectrometer consisting of 200 nm-period lightweight, alignment-insensitive critical-angle transmission (CAT) gratings and a lightweight slumped-glass Wolter-I focusing mirror…
A comparison of the performance of high resolution lithographic tools is presented here. We use extreme ultraviolet interference lithography, electron beam lithography, and He ion beam lithography tools on two different resists that are…
Dielectric metasurfaces that combine high-index materials with optical nonlinearities are widely recognized for their potential in various quantum and classical nanophotonic applications. However, the fabrication of high-quality…
We report on the fabrication and mid-infrared transmission properties of free-standing thin metal films, periodically patterned with holes at periods down to 2 microns and area of 3x3 mm2. Square grids were fabricated by electron beam…
High-resolution lithographic techniques are often limited by low volumetric throughput, since there is no universal and scalable manufacturing process that can produce 3D metasurfaces. In this work, we demonstrate a high-speed holographic…
Photonic integrated circuits (PICs) are vital for developing affordable, high-performance optoelectronic devices that can be manufactured at an industrial scale, driving innovation and efficiency in various applications. Optical loss of…
Photonic integrated circuits are heavily researched devices for telecommunication, biosensing, and quantum technologies. Wafer-scale fabrication and testing are crucial for reducing costs and enabling large-scale deployment. Grating…
Due to its exceptional lithium storage capacity silicon is considered as a promising candidate for anode material in lithium-ion batteries (LIBs). In the present work we demonstrate that methods of the soft X-ray emission spectroscopy…
Efficient fiber-to-chip couplers for multi-port access to photonic integrated circuits are paramount for a broad class of applications, ranging, e.g., from telecommunication to photonic computing and quantum technologies. While…
A hemispherical multilayer wide-band (7-13 GHz) band-pass frequency selective surface (FSS) is reported. A new design technique based on a Goldberg discretization and unit cell scaling technique is introduced to accommodate the curved…
We demonstrate an on-chip Silicon-on-Insulator (SOI) axicon etched using a low resolution (200 nm feature size, 250 nm gap) deep-ultraviolet lithographic fabrication. The axicon consists of circular gratings with seven stages of 1x2…
Colloidal lithography [1] is how patterns are reproduced in a variety of natural systems and is used more and more as an efficient fabrication tool in bio-, opto-, and nano-technology. Nanoparticles in the colloid are made to form a mask on…