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Processing cores and the accompanying main memory working in tandem enable the modern processors. Dissipating heat produced from computation, memory access remains a significant problem for processors. Therefore, processor thermal…
Modern CPUs with increasing core frequency and power are rapidly reaching a point where the CPU frequency and performance are limited by the amount of heat that can be extracted by the cooling technology. In mobile environment, this issue…
3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the…
Reliability management is one of the primary concerns in manycore systems design. Different aging mechanisms such as Negative-Bias Temperature Instability (NBTI), Electromigration (EM), and thermal cycling can reduce the reliability of…
Linear programming is used as a standard tool for optimising unit commitment or power flows in energy supply systems. For heat supply systems, however, it faces a relevant limitation: For them, energy yield depends on the output…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…
Today's systems are overwhelmingly designed to move data to computation. This design choice goes directly against at least three key trends in systems that cause performance, scalability and energy bottlenecks: (1) data access from memory…
We present a detailed thermodynamic analysis of a three-level quantum heat engine coupled continuously to hot and cold reservoirs. The system is driven by an oscillating external field and is described by the Markovian quantum master…
Interconnect is one of the main performance determinant of modern integrated circuits (ICs). The new technology of vertical ICs places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to…
Leveraging electrochemical and thermal energy storage systems has been proposed as a strategy to reduce peak power in data centers. Thermal energy storage systems, such as chilled water tanks, have gained increasing attention in data…
The autoregressive decoding in LLMs is the major inference bottleneck due to the memory-intensive operations and limited hardware bandwidth. 3D-stacked architecture is a promising solution with significantly improved memory bandwidth, which…
Temperature affects not only the reliability but also the performance, power, and cost of the embedded system. This paper proposes a thermal-aware task allocation and scheduling algorithm for embedded systems. The algorithm is used as a…
We consider a quantum engine driven by repeated weak interactions with a heat bath of identical three-level atoms. This model was first introduced by Scully et al. [Science, 2003], who showed that coherence between the energy-degenerate…
The energy efficiency and power of a quantum thermoelectric system with multiple electric currents and only one heat currents are studied. The system is connected to the hot heat bath with one terminal but the cold bath with multiple…
We consider energy minimization for data-intensive applications run on large number of servers, for given performance guarantees. We consider a system, where each incoming application is sent to a set of servers, and is considered to be…
This paper considers the problem of temperature regulation in multicore processors by dynamic voltage-frequency scaling. We propose a feedback law that is based on an integral controller with adjustable gain, designed for fast tracking…
Thermal energy agitates all matter and its competition with ordering tendencies is one of the most fundamental organizing principles in the physical world. Thus, it is natural to enquire if an effective temperature could result when…
In the paradigm of thermodynamic computing, instead of behaving deterministically, hardware undergoes a stochastic process in order to sample from a distribution of interest. While it has been hypothesized that thermodynamic computers may…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…