Related papers: TRINITY: Coordinated Performance, Energy and Tempe…
Due to embedded systems` stringent design constraints, much prior work focused on optimizing energy consumption and/or performance. Since embedded systems typically have fewer cooling options, rising temperature, and thus temperature…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
Virtually all electronic systems try to optimize a fundamental trade-off between higher performance and lower power consumption. The latter becomes critical in mobile computing systems, such as smartphones, which rely on passive cooling.…
Vision processing on traditional architectures is inefficient due to energy-expensive off-chip data movement. Many researchers advocate pushing processing close to the sensor to substantially reduce data movement. However, continuous…
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…
Data centers handle impressive high figures in terms of energy consumption, and the growing popularity of Cloud applications is intensifying their computational demand. Moreover, the cooling needed to keep the servers within reliable…
Mixed-Criticality (MC) systems have recently been devised to address the requirements of real-time systems in industrial applications, where the system runs tasks with different criticality levels on a single platform. In some workloads, a…
Modern multiprocessor system-on-chips (SoCs) integrate multiple heterogeneous cores to achieve high energy efficiency. The power consumption of each core contributes to an increase in the temperature across the chip floorplan. In turn,…
Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…
As processor performance advances, increasing power densities and complex thermal behaviors threaten both energy efficiency and system reliability. This survey covers more than two decades of research on power and thermal modeling and…
We propose in this paper to study the energy-, thermal- and performance-aware resource management in heterogeneous datacenters. Witnessing the continuous development of heterogeneity in datacenters, we are confronted with their different…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
In modern multi-core Mixed-Criticality (MC) systems, a rise in peak power consumption due to parallel execution of tasks with maximum frequency, specially in the overload situation, may lead to thermal issues, which may affect the…
An effective way to improve energy efficiency is to throttle hardware resources to meet a certain performance target, specified as a QoS constraint, associated with all applications running on a multicore system. Prior art has proposed…
Heterogeneous processors with architecturally different cores (CPU and GPU) integrated on the same die lead to new challenges and opportunities for thermal and power management techniques because of shared thermal/power budgets between…
We study scheduling problems motivated by recently developed techniques for microprocessor thermal management at the operating systems level. The general scenario can be described as follows. The microprocessor's temperature is controlled…
The race towards performance increase and computing power has led to chips with heterogeneous and complex designs, integrating an ever-growing number of cores on the same monolithic chip or chiplet silicon die. Higher integration density,…
Optimizing task-to-core allocation can substantially reduce power consumption in multi-core platforms without degrading user experience. However, existing approaches overlook critical factors such as parallelism, compute intensity, and…
Non-equilibrium effects may have a profound impact on the performance of thermal devices performing thermodynamic tasks such as refrigeration or heat pumping. The possibility of enhancing the performance of thermodynamic operations by means…
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…