Related papers: A Driver ASIC for Scientific CCD Detectors Using 1…
CLIC is a proposed linear $e^+e^-$ collider with center-of-mass energies of up to 3 TeV. Its main objectives are precise top quark, Higgs boson and Beyond Standard Model physics. In addition to spatial resolutions of a few micrometers and a…
A monolithic silicon pixel detector prototype has been produced in the SiGe BiCMOS SG13G2 130 nm node technology by IHP. The ASIC contains a matrix of hexagonal pixels with pitch of approximately 100 $\mu$m. Three analog pixels were…
The upgrade of the ATLAS muon spectrometer for high-luminosity LHC requires new trigger and readout electronics for the various elements of the detector. We present the design of a time-to-digital converter (TDC) ASIC prototype for the…
A front-end readout electronics system has been developed for silicon strip detectors. The system uses an application specific integrated circuit (ASIC) ATHED to realize multi-channel E&T measurement. The slow control of ASIC chips is…
We present the design and characterization of TIGER (Turin Integrated Gem Electronics for Readout), a 64-channel ASIC developed for the readout of the CGEM (Cylindrical Gas Electron Multiplier) detector, the proposed inner tracker for the…
We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the…
We report on the development and characterization of the low-noise, low power, mixed analog-digital SIRIUS ASICs for both the LAD and WFM X-ray instruments of LOFT. The ASICs we developed are reading out large area silicon drift detectors…
The physics aims at the proposed future high-energy linear $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. In particular, the vertex and tracking detectors have to combine a spatial resolution of a…
We present a 22 nm FD-SOI (fully depleted silicon-on-insulator) application-specific integrated circuit (ASIC) implementation of a novel soft-output Gram-domain block coordinate descent (GBCD) data detector for massive multi-user (MU)…
We characterize a new x-ray Mixed-Mode Pixel Array Detector (MM-PAD-2.1) Application Specific Integrated Circuit (ASIC). Using an integrating pixel front-end with dynamic charge removal architecture, the MM-PAD-2.1 ASIC extends the maximum…
We have designed three ASICs for possible applications in the optical links of a new layer of pixel detector in the ATLAS experiment for the first phase of the LHC luminosity upgrade. The ASICs include a high-speed driver for the VCSEL, a…
Compact multi-channel radiation detectors rely on low noise front-end application specific integrated circuits (ASICs) to achieve high spectral resolution. Here, a new ASIC developed to readout virtual Frisch-grid cadmium zinc telluride…
A new TDC-chip is under development for the COMPASS experiment at CERN. The ASIC, which exploits the 0.6 micrometer CMOS sea-of-gate technology, will allow high resolution time measurements with digitization of 75 ps, and an unprecedented…
We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the…
A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to…
We present the design and the test results of a dual-channel Vertical-Cavity Surface-Emitting Laser (VCSEL) driver ASIC LOCld65 for detector front-end readout. LOCld65 is designed in a commercial 65-nm CMOS technology with a power supply of…
The Compact Linear Collider (CLIC) is a high-energy high-luminosity linear electron-positron collider under development. It is foreseen to be built and operated in three stages, at centre-of-mass energies of 380 GeV, 1.5 TeV and 3 TeV,…
Joint progresses in Cd(Zn)Te detectors, microelectronics and interconnection technologies open the way for a new generation of instruments for physics and astrophysics applications in the energy range from 1 to 1000 keV. Even working…
A new application-specific integrated circuit (ASIC), the high-speed charge-to-time converter (QTC) IWATSU CLC101, provides three channels, each consisting of preamplifier, discriminator, low-pass filter, and charge integration circuitry,…
An Application Specific Integrated Circuit (ASIC), called RIGEL, designed for the sparse readout of a Silicon Pixel Drift Detector (PixDD) for space applications is presented.The low leakage current (less than 1 pA at +20 {\deg}C) and anode…