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Nowadays three dimension (3D) architectural visualisation has become a powerful tool in the conceptualisation, design and presentation of architectural products in the construction industry, providing realistic interaction and walkthrough…
System Level Synthesis (SLS) allows us to construct internally stabilizing controllers for large-scale systems. However, solving large-scale SLS problems is computationally expensive and the state-of-the-art methods consider only state…
Large Language Models (LLMs) have recently achieved strong performance in software code generation. However, applying them to hardware description languages (HDLs), such as Verilog, remains challenging because high-quality training data are…
The high computational demands of multiscale modeling necessitate advanced parallel and adaptive strategies. To address this challenge, we introduce an adaptive method that utilizes two microscale models based on an offline database for…
As supercomputers grow in hardware complexity, their susceptibility to faults increases and measures need to be taken to ensure the correctness of results. Some numerical algorithms have certain characteristics that allow them to recover…
Application partitioning and code offloading are being researched extensively during the past few years. Several frameworks for code offloading have been proposed. However, fewer works attempted to address issues occurred with its…
A three-dimensional (3D) Network-on-Chip (NoC) enables the design of high performance and low power many-core chips. Existing 3D NoCs are inadequate for meeting the ever-increasing performance requirements of many-core processors since they…
Flexibility at hardware level is the main driving force behind adaptive systems whose aim is to realise microarhitecture deconfiguration 'online'. This feature allows the software/hardware stack to tolerate drastic changes of the workload…
Multi-die FPGAs are crucial components in modern computing systems, particularly for high-performance applications such as artificial intelligence and data centers. Super long lines (SLLs) provide interconnections between super logic…
The high computational costs of video super-resolution (VSR) models hinder their deployment on resource-limited devices, (e.g., smartphones and drones). Existing VSR models contain considerable redundant filters, which drag down the…
Flexible Electronics (FE) have emerged as a promising alternative to silicon-based technologies, offering on-demand low-cost fabrication, conformality, and sustainability. However, their large feature sizes severely limit integration…
The Multi-Criteria Test Suite Minimization (MCTSM) problem aims to remove redundant test cases, guided by adequacy criteria such as code coverage or fault detection capability. However, current techniques either exhibit a high loss of fault…
Monolithic 3D (M3D) technology enables high density integration, performance, and energy-efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting…
Within an industrial manufacturing process, tolerancing is a key player. The dimensions uncertainties management starts during the design phase, with an assessment on variability of parts not yet produced. For one assembly step, we can gain…
The increase of generation capacity in the area of responsibility of the distribution system operator (DSO) requires strengthening of coordination between transmission system operator (TSO) and DSO in order to prevent conflicting or…
The latest sheet stamping processes enable efficient manufacturing of complex shape structural components that have high stiffness to weight ratios, but these processes can introduce defects. To assist component design for stamping…
The advent of automated vehicles operating at SAE levels 4 and 5 poses high fault tolerance demands for all functions contributing to the driving task. At the actuator level, fault-tolerant vehicle motion control, which exploits functional…
Monolithic 3D integration has become a promising solution for future computing needs. The metal inter-layer via (MIV) forms interconnects between substrate layers in Monolithic 3D integration. Despite small size of MIV, the area overhead…
The Network-on-Chip (NoC) paradigm has been proposed as a favorable solution to handle the strict communication requirements between the increasingly large number of cores on a single chip. However, NoC systems are exposed to the aggressive…
All real time tasks which are termed as critical tasks by nature have to complete its execution before its deadline, even in presence of faults. The most popularly used real time task assignment algorithms are First Fit (FF), Best Fit (BF),…