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Even with generational improvements in DRAM technology, memory access latency still remains the major bottleneck for application accelerators, primarily due to limitations in memory interface IPs which cannot fully account for variations in…
Systems that require high-throughput and fault tolerance, such as key-value stores and databases, are looking to persistent memory to combine the performance of in-memory systems with the data-consistent fault-tolerance of nonvolatile…
Many convolutional neural network (CNN) accelerators face performance- and energy-efficiency challenges which are crucial for embedded implementations, due to high DRAM access latency and energy. Recently, some DRAM architectures have been…
Computing-in-Memory (CiM) architectures aim to reduce costly data transfers by performing arithmetic and logic operations in memory and hence relieve the pressure due to the memory wall. However, determining whether a given workload can…
AI clusters today are one of the major uses of High Bandwidth Memory (HBM). However, HBM is suboptimal for AI workloads for several reasons. Analysis shows HBM is overprovisioned on write performance, but underprovisioned on density and…
Distributed shared memory (DSM) allows to implement and deploy applications onto distributed architectures using the convenient shared memory programming model in which a set of tasks are able to allocate and access data despite their…
Hybrid main memory systems combine both performance and capacity advantages from heterogeneous memory technologies. With larger capacities, higher associativities, and finer granularities, hybrid memory systems currently exhibit significant…
Scalable persistent memory (PM) has opened up new opportunities for building indexes that operate and persist data directly on the memory bus, potentially enabling instant recovery, low latency and high throughput. When real PM hardware…
As transistor-based memory technologies like dynamic random access memory (DRAM) approach their scalability limits, the need to explore alternative storage solutions becomes increasingly urgent. Phase-change memory (PCM) has gained…
Processing-in-Memory (PIM) architectures offer promising solutions for efficiently handling AI applications in energy-constrained edge environments. While traditional PIM designs enhance performance and energy efficiency by reducing data…
3D-stacked High Bandwidth Memory (HBM) architectures provide high-performance memory interactions to address the well-known performance challenge, namely the memory wall. However, these architectures are susceptible to thermal…
Putting the DRAM on the same package with a processor enables several times higher memory bandwidth than conventional off-package DRAM. Yet, the latency of in-package DRAM is not appreciably lower than that of off-package DRAM. A promising…
The rise of LLMs has driven demand for private serverless deployments, characterized by moderate-sized models and infrequent requests. While existing serverless solutions follow exclusive GPU allocation, we take a step back to explore…
Existing large language model (LLM) serving systems fall into two categories: 1) a unified system where prefill phase and decode phase are co-located on the same GPU, sharing the unified computational resource and storage, and 2) a…
In recent years, high interest in using Virtual Machines (VMs) in data centers and Cloud computing has significantly increased the demand for high-performance data storage systems. Recent studies suggest using SSDs as a caching layer for…
Co-location and memory sharing between latency-critical services, such as key-value store and web search, and best-effort batch jobs is an appealing approach to improving memory utilization in multi-tenant datacenter systems. However, we…
Response time requirements for big data processing systems are shrinking. To meet this strict response time requirement, many big data systems store all or most of their data in main memory to reduce the access latency. Main memory…
Sequential computation is well understood but does not scale well with current technology. Within the next decade, systems will contain large numbers of processors with potentially thousands of processors per chip. Despite this, many…
For the past four decades, cost and features have driven CMOS scaling. Severe lithography and material limitations seen below the 20 nm node, however, are challenging the fundamental premise of affordable CMOS scaling. Just continuing to…
The increasing growth of applications' memory capacity and performance demands has led the CPU vendors to deploy heterogeneous memory systems either within a single system or via disaggregation. For instance, systems like Intel's Knights…