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The CERN RD50 collaboration develops depleted monolithic active pixel CMOS sensors for future colliders with the aim of high radiation tolerance, good time resolution, and high granularity pixel detectors. The most recent prototype, the…

Instrumentation and Detectors · Physics 2024-09-12 Jory Sonneveld

The CLIC Tracker Detector (CLICTD) is a monolithic pixel sensor featuring pixels of 30um x 37.5um and a small collection diode. The sensor is fabricated in a 180 nm CMOS imaging process, using two different pixel flavours: the first with a…

Instrumentation and Detectors · Physics 2022-12-21 Katharina Dort

An upgrade of the ATLAS experiment for the High Luminosity phase of LHC is planned for 2024 and foresees the replacement of the present Inner Detector (ID) with a new Inner Tracker (ITk) completely made of silicon devices. Depleted active…

High-voltage CMOS (HV-CMOS) pixel technology is being considered for future Higgs factory experiments. The ATLASPix3.1 chip, with a pitch of 50$\mu m$ x 150$\mu m$, fabricated using TSI 180nm HV-CMOS technology, is a full reticle-size…

Instrumentation and Detectors · Physics 2025-02-18 F. Ustuner , R. Zanzottera , A. Andreazza , R. Dong , H. Fox , Y. Gao , P. Gheewalla , B. Masic , L. Meng , I. Peric , F. Sabatini

The physics aims at the proposed future high-energy linear $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. In particular, the vertex and tracking detectors have to combine a spatial resolution of a…

Instrumentation and Detectors · Physics 2020-10-22 Katharina Dort

The proposed Circular Electron Positron Collider (CEPC) imposes new challenges for the vertex detector in terms of pixel size and material budget. A Monolithic Active Pixel Sensor (MAPS) prototype called TaichuPix, based on a column drain…

Pixel vertex detectors are THE instrument of choice for the tracking of charged particles close to the interaction point at the LHC. Hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the present state…

Instrumentation and Detectors · Physics 2009-09-29 Norbert Wermes

Active Pixel Sensor (APS) technology has shown promise for next-generation vertex detectors. This paper discusses the design and testing of two generations of APS chips. Both are arrays of 128 by 128 pixels, each 20 by 20 micro-m. Each…

Nuclear Experiment · Physics 2011-07-19 H. S. Matis , F. Bieser , S. Kleinfelder , G. Rai , F. Retiere , H. G. Ritter , K. Singh , S. E. Wurzel , H. Wieman , E. Yamamoto

We report on a large active area (15x15mm2), high channel density (470 pixels/mm2), self-triggering CMOS analog chip that we have developed as pixelized charge collecting electrode of a Micropattern Gas Detector. This device, which…

The Circular Electron-Positron Collider (CEPC), a proposed next-generation $e^+e^-$ collider to enable high-precision studies of the Higgs boson and potential new physics, imposes rigorous demands on detector technologies, particularly the…

Instrumentation and Detectors · Physics 2025-12-02 Jiahao Hu , Ruiyang Zhang , Zhiliang Chen , Yunpeng Lu , Qun Ouyang , Lailin Xu

Monolithic CMOS pixel detectors have emerged as competitive contenders in the field of high-energy particle physics detectors. By utilizing commercial processes they offer high-volume production of such detectors. A series of prototypes has…

CMOS sensors were successfully implemented in the STAR tracker [1]. LHC experiments have shown that efficient b tagging, reconstruction of displaced vertices and identification of disappearing tracks are necessary. An improved vertex…

Instrumentation and Detectors · Physics 2021-05-21 Nicolas T. Fourches , Geraldine Hallais , Charles Renard

The Compact Linear Collider (CLIC) is a high-energy high-luminosity linear electron-positron collider under development. It is foreseen to be built and operated in three stages, at centre-of-mass energies of 380 GeV, 1.5 TeV and 3 TeV,…

Instrumentation and Detectors · Physics 2019-05-08 A. C. Abusleme Hoffman , G. Parès , T. Fritzsch , M. Rothermund , H. Jansen , K. Krüger , F. Sefkow , A. Velyka , J. Schwandt , I. Perić , L. Emberger , C. Graf , A. Macchiolo , F. Simon , M. Szalay , N. van der Kolk , H. Abramowicz , Y. Benhammou , O. Borysov , M. Borysova , A. Joffe , S. Kananov , A. Levy , I. Levy , G. Eigen , R. Bugiel , S. Bugiel , M. Firlej , T. A. Fiutowski , M. Idzik , J. Moroń , K. P. Świentek , P. Terlecki , P. Brückman de Renstrom , B. Turbiarz , T. Wojtoń , L. K. Zawiejski , E. Firu , V. Ghenescu , A. T. Neagu , T. Preda , I. Boyko , Yu. Nefedov , A. Rymbekova , A. Sapronov , G. Shelkov , A. Zhemchugov , A. Ruiz-Jimeno , I. Vila , E. Fullana , J. Fuster , P. Gomis Lopez , M. Perelló , M. A. Villarejo , M. Vos , J. Alozy , N. Alipour Tehrani , D. Arominski , R. Ballabriga Sune , F. Boyer , E. Brondolin , M. Buckland , M. Campbell , D. Dannheim , K. Dette , F. Duarte Ramos , N. Egidos Plaja , K. Elsener , A. Fiergolski , C. Fuentes Rojas , C. Grefe , D. Hynds , W. Klempt , I. Kremastiotis , J. Kröger , S. Kulis , E. Leogrande , L. Linssen , X. Llopart Cudie , A. Lucaci-Timoce , M. Munker , L. Musa , A. Nürnberg , F. -X. Nuiry , E. Perez Codina , H. Pernegger , M. Petrič , F. Pitters , T. Quast , S. Redford , P. Riedler , P. Roloff , A. Sailer , E. Santin , U. Schnoor , E. Sicking , K. Sielewicz , R. Simoniello , W. Snoeys , S. Spannagel , S. Sroka , R. Ström , P. Valerio , S. van Dam , E. van der Kraaij , T. Vǎnát , O. Viazlo , M. Vicente Barreto Pinto , M. A. Weber , M. Williams , K. Wolters , M. Benoit , G. Iacobucci , D M S Sultan , R. R. Bosley , T. Price , M. F. Watson , N. K. Watson , A. G. Winter , J. Goldstein , S. Green , J. S. Marshall , M. A. Thomson , B. Xu , G. Casse , J. Vossebeld , T. Coates , F. Salvatore , J. Repond , L. Xia , C. Kenney , A. Tomada

A hybrid pixel detector based on the concept of simultaneous charge integration and photon counting will be presented. The second generation of a counting and integrating X-ray prototype CMOS chip (CIX) has been operated with different…

Instrumentation and Detectors · Physics 2009-11-13 H. Krüger , J. Fink , E. Kraft , N. Wermes , P. Fischer , I. Peric , C. Herrmann , M. Overdick , W. Rütten

The CERN-RD50 CMOS working group develops the RD50-MPWseries of monolithic high-voltage CMOS pixel sensors for potential use in future high luminosity experiments such as the HL-LHC and FCC-hh. In this contribution, the design of the latest…

Pixel sensors based on commercial high-voltage CMOS processes are an exciting technology that is considered as an option for the outer layer of the ATLAS inner tracker upgrade at the High Luminosity LHC. Here, charged particles are detected…

In the context of the studies of the ATLAS High Luminosity LHC programme, radiation tolerant pixel detectors in CMOS technologies are investigated. To evaluate the effects of substrate resistivity on CMOS sensor performance, the H35DEMO…

Charge Coupled Devices (CCDs) have been successfully used in several high energy physics experiments over the past two decades. Their high spatial resolution and thin sensitive layers make them an excellent tool for studying short-lived…

CMOS Pixel Sensors are making steady progress towards the specifications of the ILD vertex detector. Recent developments are summarised, which show that these devices are close to comply with all major requirements, in particular the…

The ATLASpix high-voltage monolithic active pixel sensor (HV-MAPS) was designed as a technology demonstrator for the ATLAS ITk Upgrade and the CLIC tracking detector. In this contribution new results from laboratory-based energy calibration…

Instrumentation and Detectors · Physics 2022-12-21 Jens Kröger