Related papers: 3D silicon pixel detectors for the High-Luminosity…
Silicon pixel detectors developed to meet LHC requirements were tested in a beam at CERN in the framework of the ATLAS collaboration. The experimental behaviour of irradiated and not-irradiated sensors in a magnetic field is discussed. The…
Silicon pixel detectors produced according to the ATLAS Pixel Detector design were tested in a beam at CERN in the framework of the ATLAS collaboration. The detectors used n+/n sensors with oxygenated silicon substrates. The experimental…
We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\mu$m thick, produced at VTT…
The ATLAS experiment pixel detector upgrade plans are focused on development of new technology, including the FE-I4 readout integrated circuit. The first upgrade project to make use of this new technology is an "Insertable B-Layer" (IBL)…
In order to meet the requirements of the High Luminosity LHC (HL-LHC), it will be necessary to replace the current tracker of the ATLAS experiment. Therefore, a new all-silicon tracking detector is being developed, the so-called Inner…
Charge collection properties of depleted CMOS pixel detector prototypes produced on p-type substrate of 2 k$\Omega$cm initial resistivity (by LFoundry 150 nm process) were studied using Edge-TCT method before and after neutron irradiation.…
The Upgrade II of the LHCb detector, foreseen for 2031, will operate at an instantaneous luminosity of 1.5 x 10$^{34}$ cm$^{-2}$s$^{-1}$, accumulating a sample of more than 300 fb$^{-1}$. To cope with the estimated pile-up of 42 and 200…
This thesis presents the work carried out in the testing of the ATLAS Phase-II Upgrade electronic systems in the future strips tracker after 2023, to be installed for operations in the HL-LHC period. The high luminosity and number of…
We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the…
We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the…
A fast silicon-graphene hybrid plasmonic waveguide photodetectors beyond 1.55 {\mu}m is proposed and realized by introducing an ultra-thin wide silicon-on-insulator ridge core region with a narrow metal cap. With this novel design, the…
We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the…
Vertex detectors at future hadron colliders will need to cope with large particle fluences. Diamond is a particularly radiation hard material and exhibits further properties that makes it an attractive material for such detectors. Within…
An upgrade of the ATLAS experiment for the High Luminosity phase of LHC is planned for 2024 and foresees the replacement of the present Inner Detector (ID) with a new Inner Tracker (ITk) completely made of silicon devices. Depleted active…
A new pixel detector for the CMS experiment was built in order to cope with the instantaneous luminosities anticipated for the Phase~I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking with a reduced material budget…
The HL-LHC will challenge the detectors with a nearly 10-fold increase in integrated luminosity compared to the previous LHC runs combined, thus the CMS detector will be upgraded to face the higher levels of radiation and the larger amounts…
The present document discusses plans for a compact, next-generation multi-purpose detector at the LHC as a follow-up to the present ALICE experiment. The aim is to build a nearly massless barrel detector consisting of truly cylindrical…
During Large Hadron Collider (LHC) Long Shutdown 3 (LS3) (2026-28), the ALICE experiment is replacing its inner-most three tracking layers by a new detector, Inner Tracking System 3. It will be based on newly developed wafer-scale…
A silicon pixel detector with fine pitch size of 19x19 um, developed base on SOI (silicon on insulator) technology, was tested under the illumination of infrared laser pulses. As an alternative way to particle beam tests, the laser pulses…
CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher…