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The Insertable B-layer (IBL) is a fourth pixel layer that will be added inside the existing ATLAS pixel detector during the long LHC shutdown of 2013 and 2014. The new four layer pixel system will ensure excellent tracking, vertexing and…

Instrumentation and Detectors · Physics 2013-04-17 Malte Backhaus

The two innermost layers of the ALICE inner tracking system are instrumented with silicon pixel detectors. Single chip assembly prototypes of the ALICE pixels have been tested in high energy particle beams at the CERN SPS. Detection…

Nuclear Experiment · Physics 2009-11-11 D. Elia

A collaboration between Fermilab and the Institute for High Energy Physics (IHEP), Beijing, has developed a beam position monitor for the IHEP test beam facility. This telescope is based on 5 stations of silicon strip detectors having a…

Instrumentation and Detectors · Physics 2011-01-27 R. Angstadt , W. Cooper , M. Demarteau , J. Green , S. Jakubowski , A. Prosser , R. Rivera , M. Turqueti , M. Utes , Xiao Cai

The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel…

Instrumentation and Detectors · Physics 2017-03-08 N. Savic , L. Bergbreiter , J. Breuer , A. La Rosa , A. Macchiolo , R. Nisius , S. Terzo

The technological prototype of the CALICE highly granular silicon-tungsten electromagnetic calorimeter (SiW-ECAL) was tested in a beam at DESY in 2017. The setup comprised seven layers of silicon sensors. Each layer comprised four sensors,…

In the last years, high-resolution time tagging has emerged as the tool to tackle the problem of high-track density in the detectors of the next generation of experiments at particle colliders. Time resolutions below 50ps and event average…

A silicon pixel detector with fine pitch size of 19x19 um, developed base on SOI (silicon on insulator) technology, was tested under the illumination of infrared laser pulses. As an alternative way to particle beam tests, the laser pulses…

Instrumentation and Detectors · Physics 2016-08-03 Yi Liu , Yunpeng Lu , Xudong Ju , Qun Ouyang

The LHCb VELO Timepix3 telescope is a silicon pixel tracking system constructed initially to evaluate the performance of LHCb VELO Upgrade prototypes. The telesope consists of eight hybrid pixel silicon sensor planes equipped with the…

For the purpose of withstanding very high radiation doses, silicon pixel sensors with a 3D electrode geometry are being developed. Detectors of this kind are highly interesting for harch radiation environments such as expected in the High…

Silicon pixel detectors produced according to the ATLAS Pixel Detector design were tested in a beam at CERN in the framework of the ATLAS collaboration. The detectors used n+/n sensors with oxygenated silicon substrates. The experimental…

High Energy Physics - Experiment · Physics 2007-05-23 T. Lari

The ATLAS experiment pixel detector upgrade plans are focused on development of new technology, including the FE-I4 readout integrated circuit. The first upgrade project to make use of this new technology is an "Insertable B-Layer" (IBL)…

Instrumentation and Detectors · Physics 2011-09-23 M. Garcia-Sciveres , ATLAS Collaboration

We present the results of the characterization of novel n-in-p planar pixel detectors, designed for the future upgrades of the ATLAS pixel system. N-in-p silicon devices are a promising candidate to replace the n-in-n sensors thanks to…

Instrumentation and Detectors · Physics 2012-03-01 A. Macchiolo , C. Gallrapp , A. La Rosa , R. Nisius , H. Pernegger , R. H. Richter , P. Weigell

The design of a detector system comprised of four silicon sensors bump-bonded to Timepix4 ASICs is described together with its data acquisition system, operational infrastructure, and dedicated software. The spatial and temporal performance…

To cope with the High Luminosity LHC harsh conditions, the ATLAS inner tracker has to be upgraded to meet requirements in terms of radiation hardness, pile up and geometrical acceptance. The active edge technology allows to reduce the…

Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 $\mu$m, produced at CiS, and 100-200 $\mu$m thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and…

Instrumentation and Detectors · Physics 2015-06-23 S. Terzo , A. Macchiolo , R. Nisius , B. Paschen

We report results on a tracking performance study performed using a beam telescope made of 50 micron-thick CMOS pixel sensors on the 1.5 GeV electron beam at the LBNL ALS.

Instrumentation and Detectors · Physics 2009-02-16 Marco Battaglia , Devis Contarato , Piero Giubilato , Lindsay Glesener , Leo Greiner , Benjamin Hooberman

For its physics program with a high-intensity hadron beam of up to 2e7 particles/s, the COMPASS experiment at CERN requires tracking of charged particles scattered by very small angles with respect to the incident beam direction. While good…

After the successful installation and first operation of the upgraded Inner Tracking System (ITS2), which consists of about $10\,$m$^2$ of monolithic silicon pixel sensors, ALICE is pioneering the usage of bent, wafer-scale pixel sensors…

Instrumentation and Detectors · Physics 2022-12-07 Alperen Yüncü