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The DEPFET Collaboration pursues the development of a high resolution pixel vertex detector for future colliders (like ILC), based on the integration of amplifying transistors into a fully depleted bulk. In August 2008, six DEPFET…
The ATLAS experiment at the LHC will replace its current inner tracker system for the HL-LHC era. 3D silicon pixel sensors are being considered as radiation-hard candidates for the innermost layers of the new fully silicon-based tracking…
The JEM-EUSO program aims at detecting Ultra High Energy Cosmic Rays (UHECRs) by observing the fluorescence light produced by extensive air showers (EAS) in the Earth's atmosphere. Within this program, a new generation of missions is being…
The upgrade for ATLAS detector will undergo different phase towards super-LHC. The first upgrade for the Pixel detector will consist of the construction of a new pixel layer which will be installed during the first shutdown of the LHC…
The Inner Tracking System (ITS) Upgrade for the ALICE experiment at LHC is the first large-area ($\sim$10~m$^2$) silicon vertex detector based on the CMOS Monolithic Active Pixel Sensor (MAPS) technology, which combines sensitive volume and…
The High Luminosity Large Hadron Collider (HL-LHC) at CERN is expected to collide protons at a center-of-mass energy of 14 TeV and to reach the unprecedented peak instantaneous luminosity of $7.5 \times 10^{34} \text{cm}^{-2} \text{s}^{-1}$…
In the framework of the HL-LHC upgrade, the ATLAS experiment plans to introduce an all-silicon inner tracker to cope with the elevated occupancy. To investigate the suitability of pixel sensors using the proven planar technology for the…
The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;\mu\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole…
While designed primarily for X-ray imaging applications, the Medipix3 ASIC can also be used for charged-particle tracking. In this work, results from a beam test at the CERN SPS with irradiated and non-irradiated sensors are presented and…
We describe the development, operation, and application of the 4D Camera -- a 576 by 576 pixel active pixel sensor for scanning/transmission electron microscopy which operates at 87,000 Hz. The detector generates data at approximately 480…
Pixel sensors based on commercial high-voltage CMOS processes are an exciting technology that is considered as an option for the outer layer of the ATLAS inner tracker upgrade at the High Luminosity LHC. Here, charged particles are detected…
The upgrade to the High Luminosity Large Hadron Collider will pose unprecedented challenges to the tracking systems of all experiments. Recent advancement of active pixel detectors designed in CMOS processes provide attractive alternatives…
With the LHC collecting data at 7 TeV, plans are already advancing for a series of upgrades leading eventually to about five times the LHC design luminosity some 10 years from now in the High Luminosity LHC (HL-LHC) project. The upgrades…
The physics aims at the proposed future CLIC high-energy linear $e^+ e^-$ collider pose challenging demands on the performance of the detector system. In particular the vertex and tracking detectors have to combine precision measurements…
We report on a large active area (15x15mm2), high channel density (470 pixels/mm2), self-triggering CMOS analog chip that we have developed as pixelized charge collecting electrode of a Micropattern Gas Detector. This device, which…
Conventional silicon photomultipliers (SiPMs) are well established as light detectors with single-photon-detection capability and used throughout high energy physics, medical, and commercial applications. The possibility to produce single…
Samples of the monolithic silicon pixel ASIC prototype produced in 2022 within the framework of the Horizon 2020 MONOLITH ERC Advanced project were irradiated with 70 MeV protons up to a fluence of 1 x 1016 neq/cm2, and then tested using a…
The ATLAS experiment is planning a complete replacement of its inner detector(ID) with a new all-silicon inner tracker (ITk) for the ATLAS Inner Tracker Phase-2 upgrade. The ATLAS18 silicon strip sensors are designed to operate up to the…
High-voltage CMOS (HV-CMOS) pixel technology is being considered for future Higgs factory experiments. The ATLASPix3.1 chip, with a pitch of 50$\mu m$ x 150$\mu m$, fabricated using TSI 180nm HV-CMOS technology, is a full reticle-size…
A micro-pressure sensor with an isosceles trapezoidal beam-membrane (ITBM) is proposed in this paper, consisting of a square silicon membrane, four isosceles trapezoidal beams and four piezoresistors.To investigate how the elastic silicon…