Related papers: Simultaneous Multi Layer Access: A High Bandwidth …
Poor DRAM technology scaling over the course of many years has caused DRAM-based main memory to increasingly become a larger system bottleneck. A major reason for the bottleneck is that data stored within DRAM must be moved across a…
As the size of artificial intelligence and machine learning (AI/ML) models and datasets grows, the memory bandwidth becomes a critical bottleneck. The paper presents a novel extended memory hierarchy that addresses some major memory…
Response time requirements for big data processing systems are shrinking. To meet this strict response time requirement, many big data systems store all or most of their data in main memory to reduce the access latency. Main memory…
In modern systems, DRAM-based main memory is significantly slower than the processor. Consequently, processors spend a long time waiting to access data from main memory, making the long main memory access latency one of the most critical…
Over the last decade the relative latency of access to shared memory by multicore increased as wire resistance dominated latency and low wire density layout pushed multiport memories farther away from their ports. Various techniques were…
This paper summarizes the idea of Low-Cost Interlinked Subarrays (LISA), which was published in HPCA 2016, and examines the work's significance and future potential. Contemporary systems perform bulk data movement movement inefficiently, by…
This paper summarizes the idea of Tiered-Latency DRAM (TL-DRAM), which was published in HPCA 2013, and examines the work's significance and future potential. The capacity and cost-per-bit of DRAM have historically scaled to satisfy the…
As modern AI workloads increasingly rely on heterogeneous accelerators, ensuring high-bandwidth and layout-flexible data movements between accelerator memories has become a pressing challenge. Direct Memory Access (DMA) engines promise high…
Advances in hybrid bonding and packaging have driven growing interest in 3D DRAM-stacked accelerators with higher memory bandwidth and capacity. As LLMs scale to hundreds of billions or trillions of parameters, distributed inference across…
Shared virtual memory (SVM) is key in heterogeneous systems on chip (SoCs), which combine a general-purpose host processor with a many-core accelerator, both for programmability and to avoid data duplication. However, SVM can bring a…
This paper summarizes the idea of Subarray-Level Parallelism (SALP) in DRAM, which was published in ISCA 2012, and examines the work's significance and future potential. Modern DRAMs have multiple banks to serve multiple memory requests in…
Over the past two decades, the storage capacity and access bandwidth of main memory have improved tremendously, by 128x and 20x, respectively. These improvements are mainly due to the continuous technology scaling of DRAM (dynamic…
Communication in optical downlinks of low earth orbit (LEO) satellites requires interleaving to enable reliable data transmission. These interleavers are orders of magnitude larger than conventional interleavers utilized for example in…
The autoregressive decoding in LLMs is the major inference bottleneck due to the memory-intensive operations and limited hardware bandwidth. 3D-stacked architecture is a promising solution with significantly improved memory bandwidth, which…
In this paper, we conduct systematic measurement studies to show that the high memory bandwidth consumption of modern distributed applications can lead to a significant drop of network throughput and a large increase of tail latency in…
This paper investigates hardware-based memory compression designs to increase the memory bandwidth. When lines are compressible, the hardware can store multiple lines in a single memory location, and retrieve all these lines in a single…
This paper summarizes the idea of Tiered-Latency DRAM, which was published in HPCA 2013. The key goal of TL-DRAM is to provide low DRAM latency at low cost, a critical problem in modern memory systems. To this end, TL-DRAM introduces…
Modern Deep Neural Network (DNN) accelerators are equipped with increasingly larger on-chip buffers to provide more opportunities to alleviate the increasingly severe DRAM bandwidth pressure. However, most existing research on buffer…
Stacked intelligent metasurfaces (SIMs), which integrate multiple programmable metasurface layers, have recently emerged as a promising technology for advanced wave-domain signal processing. SIMs benefit from flexible spatial…
Host-GPU data movement has become a latency-critical bottleneck in LLM serving, surfacing in common paths such as model-weight movement and KV cache offload/fetch. Today, each host-GPU copy is effectively confined to the PCIe path of the…