Related papers: DMAPS: a fully depleted monolithic active pixel se…

We developed a novel design of a Micro Pixel Chamber ($\mu$-PIC) with resistive electrodes for a charged-particle-tracking detector in high-rate applications. Diamond-Like Carbon (DLC) thin film is used for the cathodes. The resistivity can…

A single-photon CMOS image sensor design based on pinned photodiode (PPD) with multiple charge transfers and sampling is described. In the proposed pixel architecture, the photogenerated signal is sampled non-destructively multiple times…

We present a 'digital SiPM' photo-detection chip combining single photon sensitive avalanche photo diodes and CMOS readout electronics on a single die. The chip has a size of $8046\times9032\,\mu m^2$ with $72.5\%$ of photo sensitive area.…

3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a…

The requirement for metamaterial perfect absorbers (MPA) based on doped semiconductors is steadily increasing due to the available matured fabrication and simulation technology. There is a particular interest in developing terahertz (THz)…

We present a compact, noise-resilient reconstructive spectrometer-on-a-chip that achieves high-resolution hyperspectral imaging across an extended near-infrared (NIR) range up to 1100nm. The device integrates monolithically fabricated…

Solid semiconductor sensors are used as detectors in high-energy physics experiments, in medical applications, in space missions and elsewhere. Minimal knowledge of the electric field inside the elementary cells of these sensors is highly…

Silicon photo-multipliers (SiPM) have been replacing traditional photomultiplier tubes in most light sensing applications. However, when large detection surface coverage is needed, photomultipliers (PMTs) are still the preferred choice. The…

In order to achieve the challenging requirements on the CLIC vertex detector, a range of technology options have been considered in recent years. One prominent idea is the use of active sensors implemented in a commercial high-voltage CMOS…

The existing ATLAS Tracker will be at its functional limit for particle fluences of 10^15 neq/cm^2 (LHC). Thus for the upgrades at smaller radii like in the case of the planned Insertable B-Layer (IBL) and for increased LHC luminosities…

3D silicon detectors are characterized by cylindrical electrodes perpendicular to the surface and penetrating into the bulk material in contrast to standard Si detectors with planar electrodes on its top and bottom. This geometry renders…

Diamond has been developed as a material for the detection of charged particles by ionization. Its radiation hardness makes it an attractive material for detectors operated in a harsh radiation environment e.g. close to a particle beam as…

CLICTD is a monolithic silicon pixel sensor fabricated in a modified 180 nm CMOS imaging process with a small collection electrode design and a high-resistivity epitaxial layer. It features an innovative sub-pixel segmentation scheme and is…

A MHz frame rate X-ray area detector (LPD - Large Pixel Detector) is under development by the Rutherford Appleton Laboratory for the European XFEL. The detector will have 1 million pixels and allows analogue storage of 512 images taken at…

Hybrid pixel single-photon-counting detectors have been successfully employed and widely used in Synchrotron radiation X-ray detection. In this paper, the silicon pixel sensors for single X-ray photon detection, which operate in…

The Super Tau-Charm Facility (STCF) is a proposed $e^+e^-$ collider with a peak luminosity 100 times higher than that of the present tau-charm factory. The inner tracker (ITK) of STCF should feature a low material budget and high readout…

We discuss a new class of Micro Pattern Gas Detectors, the Gas Pixel Detector (GPD), in which a complete integration between the gas amplification structure and the read-out electronics has been reached. An Application-Specific Integrated…

This paper addresses the challenge of integrating multistatic coherent imaging functionalities in the downlink (DL) of a phase-coherent distributed multiple input multiple output (D-MIMO) communication network. During DL, the D-MIMO access…

We propose an efficient multiband absorber comprising a truncated one-dimensional periodic metal-dielectric photonic crystal and a reflective substrate. The reflective substrate is actually an optically thick metallic film. Such a planar…

In this work, a complementary resonant structure etched on the ground plane of a microstrip line is proposed for characterizing dielectric materials. The resonant sensor is designed to operate in S-band (2 to 4 GHz). The sensor is designed…