Related papers: Thermal analysis & optimization of a 3 dimensional…
The higher speed, scalability and parallelism offered by ReRAM crossbar arrays foster development of ReRAM-based next generation AI accelerators. At the same time, sensitivity of ReRAM to temperature variations decreases R_on/Roff ratio and…
Control over surface temperature is of paramount importance in optoelectronics, photocatalysis and biosensing applications, among others. Thermoplasmonic approaches have demonstrated unrivalled performance for controlling surface…
Hidden defects affecting the interface in a composite slab are evaluated from thermal data collected on the upper side of the specimen. First we restrict the problem to the upper component of the object. Then we investigate heat transfer…
This work focuses on determining the coefficient of thermal diffusivity in a one-dimensional heat transfer process along a homogeneous and isotropic bar, embedded in a moving fluid with heat generation. A first type (Dirichlet) condition is…
The heart of every switched mode converter consists of several switching semiconductor elements. Due to their non-ideal behaviour there are ON state and switching losses heating up the silicon chip. That heat must effectively be transferred…
Energy requirements for heating and cooling of buildings constitute a major fraction of end use energy consumed. Therefore, it is important to provide the occupant comfort requirements in buildings in an energy efficient manner. However,…
Side channels remain a challenge to information flow control and security in modern computing platforms. Resource partitioning techniques that minimise the number of shared resources among processes are often used to address this challenge.…
The dynamics of social relations and the possibility of reaching the state of structural balance (Heider balance) are discussed for various networks of interacting actors under the influence of the temperature modeling the social noise…
We propose a configuration of a single three-level quantum emitter embedded in a non-equilibrium steady electromagnetic environment, able to stabilize and control the local temperatures of a target system it interacts with, consisting of a…
One of the crucial steps in the design of an integrated circuit is the minimization of heating and temperature non-uniformity. Current temperature calculation methods, such as finite element analysis and resistor networks have considerable…
Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe…
This work presents a scalable computational framework for optimal design under uncertainty with application to multi-material insulation components of building envelopes. The forward model consists of a multi-phase thermo-mechanical model…
Leveraging the latent heat of phase change materials (PCMs) can reduce the peak temperatures and transient variations in temperature in electronic devices. But as the power levels increase, the thermal conduction pathway from the heat…
Our paper presents a non-destructive thermal transient measurement method that is able to reveal differences even in the micron size range of MEMS structures. Devices of the same design can have differences in their sacrificial layers as…
We investigate the entanglement properties of thermal states of the harmonic lattice in one, two and three dimensions. We establish the value of the critical temperature for entanglement between neighbouring sites and give physical reasons.…
The use of high-level languages for designing hardware is gaining popularity since they increase design productivity by providing higher abstractions. However, one drawback of such abstraction level has been the difficulty of relating the…
In this paper we discuss the use of linked thermal and electrical network models to predict the behaviour of a complex silicon detector system. We use the silicon strip detector for the ATLAS Phase-II upgrade to demonstrate the application…
Features of thermal transport in multilayered porous silicon nanostructures are considered. Such nanostructures were fabricated by electrochemical etching of monocrystalline Si substrates by applying periodically changed current density.…
The designers pre-occupation to reduce energy consumption and to achieve better thermal ambience levels, has favoured the setting up of numerous building thermal dynamic simulation programs. The progress in the modelling of phenomenas and…
We developed high-performance thermal interface materials (TIMs) based on few-layer graphene (FLG) composite, where FLG was prepared by the interlayer catalytic exfoliation (ICE) method. We experimentally demonstrated feasibility of FLG…