Related papers: Thermal analysis & optimization of a 3 dimensional…
By combining different ideas, a general and efficient protocol to deal with discontinuous phase transitions at low temperatures is proposed. For small $T$'s, it is possible to derive a generic analytic expression for appropriate order…
Building operations represent a significant percentage of the total primary energy consumed in most countries due to the proliferation of Heating, Ventilation and Air-Conditioning (HVAC) installations in response to the growing demand for…
Building energy performance is one of the key features in performance-based building design decision making. Building envelope materials can play a key role in improving building energy performance. The thermal properties of building…
Human softness perception in haptics has mainly been studied using mechanically homogeneous objects, despite the fact that many real-world objects exhibit heterogeneous layered structures with nonuniform stiffness. This study examined how…
Architecture-based heat dissipation analyses allow us to reveal fundamental sources of inefficiency in a given processor and thereby provide us with road-maps to design less dissipative computing schemes independent of technology-base used…
Heterogeneous manycore architectures are the key to efficiently execute compute- and data-intensive applications. Through silicon via (TSV)-based 3D manycore system is a promising solution in this direction as it enables integration of…
Overheating has emerged as a primary challenge constraining the reliability and performance of next-generation high-performance electronics, such as chiplets and (ultra)wide bandgap electronics. Advanced heterogeneous integration not only…
Among all the properties required for the design of the next generation of PCM (density, heat capacity, thermal expansion, latent energy, volume change upon melting, corrosion rate, etc.) the thermal transport properties are by far the…
The simulation of heat flow through heterogeneous material is important for the design of structural and electronic components. Classical analytical solutions to the heat equation PDE are not known for many such domains, even those having…
For the development of nanoscale electronics and photonics using atomically thin two-dimensional (2D) materials, it is important to realize van der Waals (vdW) interfaces with low thermal resistance, to minimize performance reduction caused…
Thermal management in the hyper-scale cloud data centers is a critical problem. Increased host temperature creates hotspots which significantly increases cooling cost and affects reliability. Accurate prediction of host temperature is…
Extended from its electromagnetic counterpart, transformation thermodynamics applied to thermal conduction equations can map a virtual geometry into a physical thermal medium, realizing the manipulation of heat flux with almost arbitrarily…
Optimizing the operation of heating, ventilation, and air-conditioning (HVAC) systems is a challenging task, requiring the modeling of complex nonlinear relationships among HVAC load, indoor temperatures, and outdoor environments. This…
Thermoelectricity is a next-generation solution for efficient waste heat management. Although various thermoelectric materials exist, there is still a lot of scope for advancement, especially in room temperature applications. Recently,…
The emergence of data-driven science has opened up new avenues for understanding the thermophysical properties of materials. For decades, alloys are known to possess very low thermal conductivity, but the extreme thermal conductivity can be…
Thermal management is a major challenge in next-generation high-performance computing systems, particularly for heterogeneous multi-chip packages such as the NVIDIA GB200 Grace Blackwell Superchip. In this work, a physics-based…
Estimation of thermal contact resistances between cylinders can be achieved using heating on the cross sections by a laser spot and measurement of the temperature response by IR thermography. This type of measurement makes it possible to…
We have developed a technique that dramatically reduces the contact resistances and depletes a shunting channel between the contacts outside the Hall bar in ultra-high mobility SiGe/Si/SiGe heterostructures. It involves the creation of…
Advances in hybrid bonding and packaging have driven growing interest in 3D DRAM-stacked accelerators with higher memory bandwidth and capacity. As LLMs scale to hundreds of billions or trillions of parameters, distributed inference across…
We investigate the radiative heat transfer and spatial distributions of stationary temperatures in periodic many-body systems composed of alternating slabs of two different materials. We show that temperature distributions exhibit an…